Resources Contact Us Home
Wet etch processing

Image Number 4 for United States Patent #7651946.

A method of wet etching produces high-precision microneedle arrays for use in medical applications. The method achieves precise process control over microneedle fabrication, at single wafer or batch-level, using wet etching of silicon with potassium hydroxide (KOH) solution by accurately identifying the etch time endpoint. Hence, microneedles of an exactly required height, shape, sharpness and surface quality are achieved. The outcome is a reliable, reproducible, robust and relatively inexpensive microneedle fabrication process. Microneedles formed by KOH wet etching have extremely smooth surfaces and exhibit superior mechanical and structural robustness to their dry etched counterparts. These properties afford extra reliability to such silicon microneedles, making them ideal for medical applications. The needles can also be hollowed. Wet etched silicon microneedles can then be employed as masters to replicate the improved surface and structural properties in other materials (such as polymers) by moulding.

  Recently Added Patents
Bar connecting apparatus with clip advance
Ni complex and its derivatives, producing method, and the use thereof as an antioxidant
Indazole, benzisoxazole, and benzisothiazole kinase inhibitors
Speaker grill
Electric wire testing apparatus and electric wire processor equipped therewith
Scanning device
Battery stack cell monitor
  Randomly Featured Patents
Pre-processing method and system for data reduction of video sequences and bit rate reduction of compressed video sequences using temporal filtering
Adaptable controller for work vehicle attachments
Vehicle front bumper cover
Layer processing
Pattern output circuit and pattern output method
Compliant diaphragm material
Greens mower data display and controller
Apparatus and system for an adaptive data management architecture
Chelate derivatives of atrial natriuretic factor (ANF)