Resources Contact Us Home
Wet etch processing

Image Number 4 for United States Patent #7651946.

A method of wet etching produces high-precision microneedle arrays for use in medical applications. The method achieves precise process control over microneedle fabrication, at single wafer or batch-level, using wet etching of silicon with potassium hydroxide (KOH) solution by accurately identifying the etch time endpoint. Hence, microneedles of an exactly required height, shape, sharpness and surface quality are achieved. The outcome is a reliable, reproducible, robust and relatively inexpensive microneedle fabrication process. Microneedles formed by KOH wet etching have extremely smooth surfaces and exhibit superior mechanical and structural robustness to their dry etched counterparts. These properties afford extra reliability to such silicon microneedles, making them ideal for medical applications. The needles can also be hollowed. Wet etched silicon microneedles can then be employed as masters to replicate the improved surface and structural properties in other materials (such as polymers) by moulding.

  Recently Added Patents
Semiconductor process
Image processing apparatus, image forming system, and computer-readable storage medium
Systems and methods for detecting and rejecting defective absorbent articles from a converting line
Systems and methods for performing live chat functionality via a mobile device
Method and system for physical verification using network segment current
Differentiated PSIP table update interval technology
  Randomly Featured Patents
Metering apparatus
Digital wrist watch or the like
2-Benzoylchromone derivatives
Device for calculating the quantity of light and method thereof
Process for making 5-lipoxygenase inhibitors having varied heterocyclic ring systems
Semiconductor device and method of controlling the same
Cooling apparatus for an animal confinement house
Take-out mechanism for a glassware forming machine
Skin treatment composition