Resources Contact Us Home
Semiconductor device and manufacturing method of the same

Image Number 4 for United States Patent #7633133.

This invention provides a semiconductor device that solves a problem that a pattern of a wiring formed on a back surface of a semiconductor substrate is reflected on an output image. A light receiving element (e.g. a CCD, an infrared ray sensor, a CMOS sensor, or an illumination sensor) is formed on a front surface of a semiconductor substrate, and a plurality of ball-shaped conductive terminals is disposed on a back surface of the semiconductor substrate. Each of the conductive terminals is electrically connected to a pad electrode on the front surface of the semiconductor substrate through a wiring layer. The wiring layer and the conductive terminal are formed on the back surface of the semiconductor substrate except in a region overlapping the light receiving element in a vertical direction, and are not disposed in a region overlapping the light receiving element.

  Recently Added Patents
Materials for organic electroluminescent devices containing substituted 10-benzo[c]phenanthrenes
Method and device for extracting vapors in an injection molding machine
Liposomes with improved drug retention for treatment of cancer
Mirac proteins
Gas cap removal tool
X-ray imaging
Information processing apparatus capable of authentication processing with improved user convenience, control program for information processing apparatus, and recording medium having control
  Randomly Featured Patents
Opaque, electrically nonconductive region on a medical sensor
Multi-position mechanic's creeper
Antenna for vehicle window
Drain structure of electric connection box
Folding device
Application of antistatic/antireflective coating to a video display screen
Multi-layer abstraction bucket mechanism
Lighted bollard
Method for removing color from polymeric material
Thermally activated variable stiffness composites for aircraft seals