Resources Contact Us Home
Printed circuit board assembly with shock absorbing structure

Image Number 4 for United States Patent #7583516.

An exemplary printed circuit board assembly includes a printed circuit board, four supporting members, four shock-absorption members, and four fixing members. The printed circuit board defines a plurality of cutouts therein. Each supporting member defines a positioning hole therein. The shock-absorption members are snapped in the cutouts, and each has a first surface contacting the corresponding supporting member, a second surface parallel to the first surface, and a through hole extending through the first and second surfaces. The first and second surfaces are disposed at opposite sides of the printed circuit board. Each fixing member comprises a first portion pressed on the second surface of the corresponding shock-absorption member, and a second portion extending through the through hole and engaging in the positioning hole.

  Recently Added Patents
FET device having ultra-low on-resistance and low gate charge
Method for determining the local position of at least one mobile radio communication device based on predetermined local positions of adjacent radio communication devices, associated radio com
Synergistic fungicidal interactions of 5-fluorocytosine and other fungicides
Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof
Repeating frame battery with joining of cell tabs via welded-on male and female slip-fit connectors
Authenticating messages sent between a vehicle and a central facility
  Randomly Featured Patents
Cord stopper
DTMF signalling between mobile and server
New method for preparing pentanitroaniline and triaminotrinitrobenzenes from trinitrotoluene
Membrane comprising oxyethylene groups
Atrial ablation catheter and method of use
Optoelectronic semiconductor device
Barrier structure
Touch engageable fastener
Additional heteropolycyclic compounds and their use as metabotropic glutamate receptor antagonists
Method of producing alloyed metal contact layers on crystal-orientated semiconductor surfaces by energy pulse irradiation