Resources Contact Us Home
Socket and method for compensating for differing coefficients of thermal expansion

Image Number 2 for United States Patent #7530853.

The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises an aperture, wherein the surface mounted contacts extend from the aperture. At least one plate connects to the elongated housing, wherein the at least one plate has a coefficient of thermal expansion selected to compensate for a difference in coefficients of thermal expansion between the socket and a printed circuit board.

  Recently Added Patents
Discharge lamp lighting circuit
Systems and methods for a signed magnitude adder in one's complement logic
Efficient file system metadata scanning using scoped snapshots
Enterprise seamless mobility
Detecting mirrors on the web
Electronic device with a screen
  Randomly Featured Patents
Apparatus for manufacture of tubular elements for ink jet printers
Chuck with rotary vane actuator
Continuous ink jet printer having modular print head assembly
Fast opening arrangement for shoes of bicycle brakes
Pulverulent material metering and delivery system and method
Jewel piece
Stabilizer bar having variable torsional stiffness
Human TSC--22 Homolog
Abnormality determining apparatus, image forming apparatus, copying machine, and information obtaining method
Gas turbine apparatus