Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Socket and method for compensating for differing coefficients of thermal expansion










Image Number 2 for United States Patent #7530853.

The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises an aperture, wherein the surface mounted contacts extend from the aperture. At least one plate connects to the elongated housing, wherein the at least one plate has a coefficient of thermal expansion selected to compensate for a difference in coefficients of thermal expansion between the socket and a printed circuit board.








 
 
  Recently Added Patents
Flash drive
Self-correcting amplifier system
Administrable compositions
Advertising system and method
Segmented display panel and camera with segmented display
Device to control force required to depress accelerator pedal
Photon density wave based determination of physiological blood parameters
  Randomly Featured Patents
Golf swing and ball flight recording system
System and method for copy protection for digital signals
Bulk document feeder with removable cartridge
Flexible printed wiring board
Fragrance dispenser
Heat treating
Focal point adjusting device for zoom lens
Method for manufacturing SIMOX wafer and SIMOX wafer
Method of providing malpractice insurance
Flip up telescope assembly