Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Socket and method for compensating for differing coefficients of thermal expansion










Image Number 2 for United States Patent #7530853.

The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises an aperture, wherein the surface mounted contacts extend from the aperture. At least one plate connects to the elongated housing, wherein the at least one plate has a coefficient of thermal expansion selected to compensate for a difference in coefficients of thermal expansion between the socket and a printed circuit board.








 
 
  Recently Added Patents
Musical wind instrument with inner waveguide reflector assembly
Autofocus device for microscopy
Electromagnetic-type touch input device, and touch display device incorporating the same
Inhibitors of nitric oxide synthase for treatment of melanoma
Cartridge unit and trap for sewer gas and odor containment
Transmitting system and method of transmitting digital broadcast signal in transmitting system
Expandable prosthetic valve crimping device
  Randomly Featured Patents
Multiway valve
Apparatus for balancing rotating member
Creep resistant magnesium alloy with improved ductility and fracture toughness for gravity casting applications
Device for the horizontal stabilization of a vertically supported mass
Antibodies which bind the G-CSF receptor extracelluar domain and methods of treatment
Miter saw with improved safety system
Light condensing-type solar generator system
Fitting for tightening steel pipe
Spring disconnect mechanism for self centering multiple axis analog control stick
Method and apparatus for the characterization of a depth structure in a substrate