Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Socket and method for compensating for differing coefficients of thermal expansion










Image Number 2 for United States Patent #7530853.

The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises an aperture, wherein the surface mounted contacts extend from the aperture. At least one plate connects to the elongated housing, wherein the at least one plate has a coefficient of thermal expansion selected to compensate for a difference in coefficients of thermal expansion between the socket and a printed circuit board.








 
 
  Recently Added Patents
Dynamic load profiling in a power network
Vehicle exterior
Methods and compositions to treat and detect misfolded-SOD1 mediated diseases
Graphical communication user interface with graphical position user input mechanism for selecting a display image
Oxidative coupling of hydrocarbons as heat source
Method for generating codewords
Code conversion apparatus, code conversion method, and computer product
  Randomly Featured Patents
Socket connector
Apparatus and methods of forming a gas cluster ion beam using a low-pressure source
Wood-type golf club head
Apparatus for fabricating wood structures
Rapid non-destructive screening methods for polymeric coatings and materials
7-[2-(2- aminothiazol-4-yl)-2-oximino-acetamido-3-quaternary-ammonium-methyl-3-cep hem-4-carboxylates
Down pressure apparatus
Process for producing ferroelectric liquid-crystal cells
Infant car seat handle
Self-curable inorganic composition