Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Socket and method for compensating for differing coefficients of thermal expansion










Image Number 2 for United States Patent #7530853.

The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises an aperture, wherein the surface mounted contacts extend from the aperture. At least one plate connects to the elongated housing, wherein the at least one plate has a coefficient of thermal expansion selected to compensate for a difference in coefficients of thermal expansion between the socket and a printed circuit board.








 
 
  Recently Added Patents
Wireless updating of hearing devices
Computer implemented apparatus for generating and filtering creative proposal
Particulate filter with hydrogen sulphide block function
Video recording and playing apparatus and its control method
Method and composition for hyperthermally treating cells
Magnetic levitation motor used in lens module
Combined imaging and radiation therapy
  Randomly Featured Patents
Blade assembly for double end nibbler tool
Semiconductor memory having electrically erasable and programmable semiconductor memory cells
Rain shield canopy for use with an automobile
Drive mechanism for a magnetic head carriage assembly
Power control switch
Method and system for providing network and routing protocols for utility services
Bridged ketones, process for preparing same and use thereof in augmenting or enhancing fabric softeners
Strainer insert for a container
Adaptive-load inverters and methods
ESP/gas lift back-up