Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Socket and method for compensating for differing coefficients of thermal expansion










Image Number 2 for United States Patent #7530853.

The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises an aperture, wherein the surface mounted contacts extend from the aperture. At least one plate connects to the elongated housing, wherein the at least one plate has a coefficient of thermal expansion selected to compensate for a difference in coefficients of thermal expansion between the socket and a printed circuit board.








 
 
  Recently Added Patents
Mirror elements for EUV lithography and production methods therefor
Method for parking or exiting a parking bay and for avoiding a collision of a vehicle, and corresponding assistance systems and vehicle
Deflection device for a scanner with Lissajous scanning
Electric rotating machine for vehicle
Method and device for synthesizing image
Methods and apparatus for preserving privacy in an RFID system
Method and systems for detecting duplicate travel path
  Randomly Featured Patents
Hydrostatic liquid-metal deformable optical elements
General packing of expanded graphite
Control valve for a fuel injector comprising a pressure exchanger
Trailer hitch ball display
Resin modification for glass fiber adherence
Networked computer system with reduced vulnerability to directed attacks
Wrench socket
Method of forming meltblown webs containing particles
Selective disablement in fail-operational, fail-safe multi-computer control system
Method and apparatus for image production by selective or random exposure element activation