Resources Contact Us Home
Socket and method for compensating for differing coefficients of thermal expansion

Image Number 2 for United States Patent #7530853.

The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises an aperture, wherein the surface mounted contacts extend from the aperture. At least one plate connects to the elongated housing, wherein the at least one plate has a coefficient of thermal expansion selected to compensate for a difference in coefficients of thermal expansion between the socket and a printed circuit board.

  Recently Added Patents
Enterprise seamless mobility
System and method for associating financial transaction data with a user's project data using a portable electronic device
Cancer vaccines containing epitopes of oncofetal antigen
Label printer
Parallel power inverter motor drive system
Polyfunctional sulfur-containing epoxies and compositions thereof
Printed wiring board with reinforced insulation layer and manufacturing method thereof
  Randomly Featured Patents
Methods and apparatus for switching packets
Semiconductor integrated circuit device
Target game apparatus
Method of generating extreme ultraviolet radiation
Apparatus for controlling device start up and off/on running periods
Rolling mill
Methods for effectuating mRNA transfer of genetic information between species and product of the same
Cylindrical vase
Exhaust purification system
Method for generalized extracorporeal support