Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Socket and method for compensating for differing coefficients of thermal expansion










Image Number 2 for United States Patent #7530853.

The illustrative embodiments provide a socket, a method for manufacturing the socket, a device, and a method for compensating for a difference in the coefficients of thermal expansion between a socket and a printed circuit board. The socket includes surface mounted contacts and an elongated housing. The elongated housing comprises an aperture, wherein the surface mounted contacts extend from the aperture. At least one plate connects to the elongated housing, wherein the at least one plate has a coefficient of thermal expansion selected to compensate for a difference in coefficients of thermal expansion between the socket and a printed circuit board.








 
 
  Recently Added Patents
Microwavable bag
Horse stationary tab
Retrievable outgoing audio messaging
Maize variety X00C175
Radio communication device and sequence length adjusting method
Pluggable power cell for an inverter
Method and apparatus of motion vector prediction with extended motion vector predictor
  Randomly Featured Patents
Methods and apparatus for data transfer between partitions in a computer system
Electrical discharge machining electrode holder
Implant for the jaw
Chrysanthemum plant named `Yolucy`
Metallization on titanium aluminide
Fluid coupled control system for irrigation
Assembly of a support and thread tensioners for a bobbin creel
Nozzle
Pliabilized polypropylene surgical filaments
Energy consumption analysis for use with a storage system