Resources Contact Us Home
Low profile integrated module interconnects and method of fabrication

Image Number 5 for United States Patent #7506438.

A low profile integrated module is fabricated to include sheets of material, such as ceramic or PCB, fixed together and including a via extending through at least one of the plurality of sheets from the lower module surface partially to the upper module surface and in a side module surface. The via is filled with conductive material. The module is then mounted on a supporting substrate having a solder pad on the mounting surface with an area greater than the lower surface of the via. The lower surface of the via is positioned adjacent the upper surface of the mounting pad and soldered so that solder wicks up the via along the side module surface.

  Recently Added Patents
Optical writer and image forming apparatus including same
Method of manufacturing semiconductor device
Corner wrap for use with a pallet
Systems and methods for a signed magnitude adder in one's complement logic
Catalysts for polyurethane coating compounds
Method of driving stereoscopic display apparatus and stereoscopic display apparatus
Schottky diode and method of manufacture
  Randomly Featured Patents
Advancing tailpiece
Outsole for a golf shoe
Thread feeder for knitting machines
Light source device using a double-tube dielectric barrier discharge lamp and output stabilizing power source
Tool for opening a can with a top which is easy to open
Optical fiber subscriber network
Method for producing printed patches for optical and high-contrast guidance
Method of providing an interface to a plurality of peripheral devices using bus adapter chips
Absorbent article
Digital photo frame