Resources Contact Us Home
Low profile integrated module interconnects and method of fabrication

Image Number 5 for United States Patent #7506438.

A low profile integrated module is fabricated to include sheets of material, such as ceramic or PCB, fixed together and including a via extending through at least one of the plurality of sheets from the lower module surface partially to the upper module surface and in a side module surface. The via is filled with conductive material. The module is then mounted on a supporting substrate having a solder pad on the mounting surface with an area greater than the lower surface of the via. The lower surface of the via is positioned adjacent the upper surface of the mounting pad and soldered so that solder wicks up the via along the side module surface.

  Recently Added Patents
Delivery method for internet protocol television (IPTV)
Control apparatus and panel assembly comprising said control apparatus
Unified and best messaging systems for communication devices
Solar-powered quadricycle with regenerative and dissipative braking
Alternate fuel storage system and method
Pneumatic transport zone exchange system and method
  Randomly Featured Patents
Thermal sensor for a lighting fixture
Image pickup apparatus and image pickup method
Support stand for flat-panel display monitor
System and method for processing and storing signal information in an implantable cardiac device
Programmable linear-in-dB or linear bias current source and methods to implement current reduction in a PA driver with built-in current steering VGA
Microphone preamplifier
Fuel cell devices and method therefor
Semiconductor package and amplifier employing the same
Field emission system and method for improving its vacuum
Soybean cultivar S100004