Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Low profile integrated module interconnects and method of fabrication










Image Number 5 for United States Patent #7506438.

A low profile integrated module is fabricated to include sheets of material, such as ceramic or PCB, fixed together and including a via extending through at least one of the plurality of sheets from the lower module surface partially to the upper module surface and in a side module surface. The via is filled with conductive material. The module is then mounted on a supporting substrate having a solder pad on the mounting surface with an area greater than the lower surface of the via. The lower surface of the via is positioned adjacent the upper surface of the mounting pad and soldered so that solder wicks up the via along the side module surface.








 
 
  Recently Added Patents
Method and apparatus for verifiable generation of public keys
Method for specifying control curve parameters for controlling climatic environmental conditions of climate-controlled enclosed spaces
Toy vehicle housing
Signal generator
Method for manufacturing a turbine engine vane
Systems, methods, and devices for selling transaction instruments via web-based tool
Magnetic recording medium, information storage device, and method of manufacturing magnetic recording medium
  Randomly Featured Patents
Implement positioning assembly for a machine
Method and apparatus for dynamic trimming of fuel system
Bond wire configuration and injection mold for minimum wire sweep in plastic IC packages
System and method for implementing conditional vector operations in which an input vector containing multiple operands to be used in conditional operations is divided into two or more output v
Editing text within a three-dimensional graphic
Electromagnetic actuator for a hydraulic directional control valve
Target seeker simulator
Lead-europium selenide-telluride heterojunction semiconductor laser
Package
Bi-flow expansion device