Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Low profile integrated module interconnects and method of fabrication










Image Number 5 for United States Patent #7506438.

A low profile integrated module is fabricated to include sheets of material, such as ceramic or PCB, fixed together and including a via extending through at least one of the plurality of sheets from the lower module surface partially to the upper module surface and in a side module surface. The via is filled with conductive material. The module is then mounted on a supporting substrate having a solder pad on the mounting surface with an area greater than the lower surface of the via. The lower surface of the via is positioned adjacent the upper surface of the mounting pad and soldered so that solder wicks up the via along the side module surface.








 
 
  Recently Added Patents
Delay interferometer using magneto-optic effect of a variable faraday rotator
Systems and methods for online search recirculation and query categorization
(4942
Towel clip
Electrophotographic photoreceptor and image forming apparatus including the same
Cable exit trough with insert
Closed-loop adaptive adjustment of pacing therapy based on cardiogenic impedance signals detected by an implantable medical device
  Randomly Featured Patents
Fluid distributor and device for treating a fluid such as a chromatograph equipped with said distributor
Simultaneous determination of chlorine and chlorate in sodium hypochlorite
Wafer level contact sheet and method of assembly
Medical transfer device
Fuel igniter comprising a novel silicon carbide composition and process for preparing the composition
Set of icons for a computer screen
Seal arrangement on a vertical frame profile of a door wing
Microgel-containing rubber mixtures with masked bi-functional mercaptans and vulcanization products produced therefrom
Patient transfer apparatus
Semiconductor device and method of fabricating the same