Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Low profile integrated module interconnects and method of fabrication










Image Number 5 for United States Patent #7506438.

A low profile integrated module is fabricated to include sheets of material, such as ceramic or PCB, fixed together and including a via extending through at least one of the plurality of sheets from the lower module surface partially to the upper module surface and in a side module surface. The via is filled with conductive material. The module is then mounted on a supporting substrate having a solder pad on the mounting surface with an area greater than the lower surface of the via. The lower surface of the via is positioned adjacent the upper surface of the mounting pad and soldered so that solder wicks up the via along the side module surface.








 
 
  Recently Added Patents
Image quality assessment
Proximity-based mobile message delivery
Caprazene as a novel compound and derivatives thereof, and caprazol as a novel compound and derivatives thereof
System and method for parallel video processing in multicore devices
Organic metal complex and its use in organic electroluminescent device
Method and computer system for automatic vectorization of a vessel tree
Multibranched polymer and method for producing the same
  Randomly Featured Patents
Tool holder with specification marking structure
Sarcococca plant named `Sarsid 2`
Set of handset keys
Hot applied, expandable sealer
Doghouse with door flap
Hybrid powertrain with an engine input clutch and method of control
Method of fabricating a capacitor structure for a semiconductor memory device
Railroad car coupler centering device
System/method for synchronized shifting of a manually shifted transmission
Systems and methods facilitating communication with remote computers