Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Low profile integrated module interconnects and method of fabrication










Image Number 5 for United States Patent #7506438.

A low profile integrated module is fabricated to include sheets of material, such as ceramic or PCB, fixed together and including a via extending through at least one of the plurality of sheets from the lower module surface partially to the upper module surface and in a side module surface. The via is filled with conductive material. The module is then mounted on a supporting substrate having a solder pad on the mounting surface with an area greater than the lower surface of the via. The lower surface of the via is positioned adjacent the upper surface of the mounting pad and soldered so that solder wicks up the via along the side module surface.








 
 
  Recently Added Patents
Nucleic acid-based tests for prenatal gender determination
Light-emitting device
Medical injector
IC layout parsing for multiple masks
Control apparatus for autonomous operating vehicle
Fluid handling structure, a lithographic apparatus and a device manufacturing method
Faucet
  Randomly Featured Patents
Adjustable filter holder assembly
Integrated meter transponder
Garnet single crystal film for magnetic bubble domain devices
Integrated audio video signal processing system using centralized processing of signals
Eco-run control device and eco-run control method
Method for longwall mining with side-by-side arch sections
Wristwatch
Dynamic stress controlling flexible hose section
Shoulder pad assembly for contact sports
1-(P-Alkanoylphenyl) alkanols and derivatives