Resources Contact Us Home
Low profile integrated module interconnects and method of fabrication

Image Number 5 for United States Patent #7506438.

A low profile integrated module is fabricated to include sheets of material, such as ceramic or PCB, fixed together and including a via extending through at least one of the plurality of sheets from the lower module surface partially to the upper module surface and in a side module surface. The via is filled with conductive material. The module is then mounted on a supporting substrate having a solder pad on the mounting surface with an area greater than the lower surface of the via. The lower surface of the via is positioned adjacent the upper surface of the mounting pad and soldered so that solder wicks up the via along the side module surface.

  Recently Added Patents
Method and system for encrypting data in a wireless communication system
Digital broadcasting system and method of processing data in digital broadcasting system
Flat panel display device and stereoscopic display device
Television apparatus
Method and system for producing fluoride gas and fluorine-doped glass or ceramics
Technique for effectively providing program material in a cable television system
Battery pouch sheet edge insulation
  Randomly Featured Patents
Combined article holder and cigarette snuffer
Liquid crystal display unit having large image area and high resolution
Adjustable clamp for holding objects securely in position
Method of maintaining data consistency in a loose transaction model
Raman amplifier, optical repeater, and raman amplification method
Method and apparatus to facilitate superconductivity by exciting a material at its resonant frequency of molecular vibration
Aminoisoquinoline derivatives
Device for detecting displacement between patterns
Earpiece having detachable battery device