Resources Contact Us Home
Multilayer dielectric substrate and semiconductor package

Image Number 7 for United States Patent #7504710.

A multilayer dielectric substrate that mounts a semiconductor device in a cavity formed on a substrate. The multilayer dielectric substrate includes an opening formed in a surface-layer grounding conductor on the substrate in the cavity, and an impedance transformer, with a length of about 1/4 of an in-substrate effective wavelength of a signal wave, electrically connected through the opening to the cavity. The multilayer dielectric substrate further includes a short-circuited end dielectric transmission line with a length of about 1/4 of the in-substrate effective wavelength of the signal wave, a coupling opening formed on an inner-layer grounding conductor in a connecting section of the impedance transformer and the dielectric transmission line, and a resistor formed in the coupling opening.

  Recently Added Patents
Apparatus and method for recording reboot reason of equipment
Guitar strap attachment means
Optical cable plug-in detection
Refuelable battery-powered electric vehicle
Manufacturing method power semiconductor device
Polymeric structures comprising a siloxane
  Randomly Featured Patents
Multicast transmission in packet based cellular networks
System for preventing sudden cardiac death by nerve sprouting from right stellate ganglion
Method and apparatus for indexing rich internet content using contextual information
Device for controlling a regulated system, and an engine including such a device
Means and methods for preserving microprocessor memory
Program verification for cable television at a consumer location
Electrochemical cell and electrochemical capacitor
Integrated home service network
Electric liquid-heating
Transform speech signal coding with pitch controlled adaptive quantizing