Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Multilayer dielectric substrate and semiconductor package










Image Number 2 for United States Patent #7504710.

A multilayer dielectric substrate that mounts a semiconductor device in a cavity formed on a substrate. The multilayer dielectric substrate includes an opening formed in a surface-layer grounding conductor on the substrate in the cavity, and an impedance transformer, with a length of about 1/4 of an in-substrate effective wavelength of a signal wave, electrically connected through the opening to the cavity. The multilayer dielectric substrate further includes a short-circuited end dielectric transmission line with a length of about 1/4 of the in-substrate effective wavelength of the signal wave, a coupling opening formed on an inner-layer grounding conductor in a connecting section of the impedance transformer and the dielectric transmission line, and a resistor formed in the coupling opening.








 
 
  Recently Added Patents
Wireless communication system, wireless communication device, wireless communication method, and program
Switching device, switch control method, and storage system
Management of temporal data by means of a canonical schema
(4936
Wireless communication system, associated methods and data structures
Telephone relaying apparatus, telephone relaying method, and program
Performance metrics processing for anticipating unavailability
  Randomly Featured Patents
Rack and pinion steering apparatus
Gravity meter digitizer
Illuminating device for a magnetic compass
Tampon with adjacent wide and narrow raised portions
Hermetically sealed capacitor assembly
Digital radiography sensors
Method and apparatus for variably regulating the length of a combined spinal-epidural needle
Semiconductor device having an angled compensation implant and method of manufacture therefor
Mirror
Workpiece transfer mechanism