Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Electronic assembly with hot spot cooling










Image Number 3 for United States Patent #7489033.

A composite of two or more thermal interface materials ("TIMs") is placed between a die and a heat spreader to improve cooling of the die in an integrated circuit package. The two or more TIMs vary in heat-dissipation capability depending upon the locations of die hot spots. In an embodiment, a more thermally conductive material may be positioned over one or more die hot spots, and a less thermally conductive material may be positioned abutting and/or surrounding the more thermally conductive material. The two or more TIMs may comprise a solder and a polymer. The composite TIM may be preformed as one unit or as a plurality of units. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.








 
 
  Recently Added Patents
Rear bumper for an automobile
Structural plasticity in spiking neural networks with symmetric dual of an electronic neuron
Method and apparatus for re-routing calls in a packet network during failures
Device for producing a connection grid with an integrated fuse
Method for indicating the process of leaving a parking space
Method and system for remote delivery of email
Oxide material, electrophotographic photoreceptor, process cartridge, and image forming device
  Randomly Featured Patents
Clotting assay and reagent therefor
Surface cleaning compositions
Spin drier for semiconductor material
Cellulose ester derivatives and a process for the production thereof
Thermosetting compositions comprising conjugated diene polymers having pendant unsaturated groups and calcium carbonate
Process for preparing thermally stabilized oxymethylene polymer from trioxane with thiocyanate and radiation
Hammer
Ski rack for an automobile or the like
Torque converter and slipping clutch assembly
Wood splitter