Resources Contact Us Home
Electronic assembly with hot spot cooling

Image Number 3 for United States Patent #7489033.

A composite of two or more thermal interface materials ("TIMs") is placed between a die and a heat spreader to improve cooling of the die in an integrated circuit package. The two or more TIMs vary in heat-dissipation capability depending upon the locations of die hot spots. In an embodiment, a more thermally conductive material may be positioned over one or more die hot spots, and a less thermally conductive material may be positioned abutting and/or surrounding the more thermally conductive material. The two or more TIMs may comprise a solder and a polymer. The composite TIM may be preformed as one unit or as a plurality of units. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

  Recently Added Patents
Trash bag retention device
Polymers derived from benzobis(silolothiophene) and their use as organic semiconductors
Illumination unit for a direct-view display
Systems and methods for automated institutional processing of payments
Flash multi-level threshold distribution scheme
Focus adjustment unit and optical scanning microscope
Flat panel display device and stereoscopic display device
  Randomly Featured Patents
Hydroponics tray
Embedded duplex local control panel
Systems and methods for configuring load/store execution units
Methods and compositions for the detection of X-ray and gamma-ray radiation
Electric iron having electronic control circuit with a power resistor mounted on the soleplate
Weather strip for use in automobile
.beta.-fructofuranosidase, its preparation and uses
Observation apparatus for selectively providing color signals
Electrostatic recording medium with elongated conductive segments
Astilbe plant named `White Wings`