Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Cleaning method and solution for cleaning a wafer in a single wafer process










Image Number 13 for United States Patent #7456113.

The present invention is a method of use of a novel cleaning solution in a single wafer cleaning process. According to the present invention the method involves using a cleaning solution in a single wafer mode and the cleaning solution comprises at least ammonium hydroxide (NH.sub.4OH), hydrogen peroxide (H.sub.2O.sub.2), water (H.sub.2O) and a chelating agent. In an embodiment of the present invention the cleaning solution also contains a surfactant. Moreover, the present invention also teaches a method of combining an ammonia hydroxide, hydrogen peroxide, and chelating agent step with a short HF step in a fashion that minimizes process time in a way that the entire method removes aluminum and iron contamination efficiently without etching too much oxide.The single wafer cleaning processes may also be used to increase the yield of high-grade reclaimed wafers.








 
 
  Recently Added Patents
(4936
Monitoring cloud-runtime operations
System and method for redirected firewall discovery in a network environment
Packet bundling at the PDCP layer
Method and system for migrating object update messages through synchronous data propagation
Detection and use of low molecular-weight modulators of the cold-menthol receptor TRPM8
Linear transformer power supply
  Randomly Featured Patents
Apparatus for inductively coupling signals between a downhole sensor and the surface
Modular component for use as a table top and bench seat
Classification of patient conditions using known and artificial classes
Handbag
Vehicle rollover sensing using angular rate sensors
Laser suturing of biological materials
Foot prosthesis with modular foot plate
Fusible link with built-in redundancy
Article identification and surveillance tag
Homogenizing device for a fluid carried in a pipe