Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Quality of service for data storage volumes










Image Number 5 for United States Patent #7418531.

The invention classifies volumes (e.g., file systems or LUNs) of a data storage system according to application requirements and allocates space for the volumes on storage devices (e.g., hard disk drives) accordingly. A person such as an IT administrator configures the volumes specifying size, type (e.g., file system or SAN LUN), and priority (e.g., high, medium, low, or archive). The host schedules I/O requests to the storage devices in priority queues using the volume definition to match the application requirements and reduce storage seek time between volumes of different priorities. The host also allocates high performance bands of the storage devices to high performance applications and lower performance bands to lower performance applications. In this manner, the data storage system places data on the band of the storage device that best supports its performance needs.








 
 
  Recently Added Patents
Identifying media content in queries
Computer program and apparatus for evaluating signal propagation delays
High surface area composition for use in the catalytic hydroconversion of a heavy hydrocarbon feedstock, a method making such composition and its use
Method for manufacturing a magnet coil configuration using a slit band-shaped conductor
Method and apparatus for wireless transmission of diagnostic information
Lid for a container
Dispensing of restricted goods
  Randomly Featured Patents
Nonvolatile semiconductor memory with a source line potential level detection circuit
Control of gas phase polymerization reactions
Pattern inspection method and apparatus using electron beam
RF driven sulfur lamp having driving electrodes which face each other
Power tool charging system having a charge level indicator and charge control functions
Chair back
Bottle
LED streetlight lamp
Immersion fluids for lithography
Semiconductor chip assembly with bump/base heat spreader and cavity in bump