Resources Contact Us Home
High density nanostructured interconnection

Image Number 4 for United States Patent #7402913.

A method and apparatus for forming an electrically and/or thermally conducting interconnection is disclosed wherein a first surface and a second surface are contacted with each other via a plurality of nanostructures disposed on at least one of the surfaces. In one embodiment, a first plurality of areas of nanostructures is disposed on a component in an electronics package such as, illustratively, a microprocessor. The first plurality of areas is then brought into contact with a corresponding second plurality of areas of nanostructures on a substrate, thus creating a strong friction bond. In another illustrative embodiment, a plurality of nanostructures is disposed on a component, such as a microprocessor, which is then brought into contact with a substrate. Intermolecular forces result in an attraction between the molecules of the nanostructures and the molecules of the substrate, thus creating a bond between the nanostructures and the substrate.

  Recently Added Patents
Autonomous downlink code selection for femto cells
Fast carrier allocation in multi-carrier systems
EpCAM as a reprogramming factor for non-pluripotent cells
Systems and methods for controlling registration of advancing substrates in absorbent article converting lines
Switched capacitor amplifier
Method of driving stereoscopic display apparatus and stereoscopic display apparatus
End-of-session authentication
  Randomly Featured Patents
Supporting device for a golf bag
Direct backlight module
System search to detect for a wireless communication network in a crowded frequency band
Method of improved three dimensional display technique
Anionic dispersants for aqueous slurries of carbonaceous materials
Tax-free gifting
Device for cleaning a paper machine wire web
Portable sequential compression device
Radio communication system, base station apparatus, mobile station apparatus, and radio communication method
Non-linear temperature compensation circuit