Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
High density nanostructured interconnection










Image Number 4 for United States Patent #7402913.

A method and apparatus for forming an electrically and/or thermally conducting interconnection is disclosed wherein a first surface and a second surface are contacted with each other via a plurality of nanostructures disposed on at least one of the surfaces. In one embodiment, a first plurality of areas of nanostructures is disposed on a component in an electronics package such as, illustratively, a microprocessor. The first plurality of areas is then brought into contact with a corresponding second plurality of areas of nanostructures on a substrate, thus creating a strong friction bond. In another illustrative embodiment, a plurality of nanostructures is disposed on a component, such as a microprocessor, which is then brought into contact with a substrate. Intermolecular forces result in an attraction between the molecules of the nanostructures and the molecules of the substrate, thus creating a bond between the nanostructures and the substrate.








 
 
  Recently Added Patents
Camera
Method, computer program product, and apparatus for deriving intelligence from format change requests
Field effect transistor having multiple effective oxide thicknesses and corresponding multiple channel doping profiles
Trellis modulation protocols for a VDSL system
Bolus
Dietary composition and method of using the same
Method for providing medical test results
  Randomly Featured Patents
Remote anomaly diagnosis and reconfiguration of an automatic data collection device platform over a telecommunications network
Adjustable double-acting damper
Common rate control command generation
Phenyl benzothiadiazole ether herbicides
Molded archery arrow for an archery bow with a metal barrel
Putter head
Teether
Security system
Automatic levelling system
Lanthanum cerium aluminate phosphor and an electrical discharge device containing the same