Resources Contact Us Home
High density nanostructured interconnection

Image Number 4 for United States Patent #7402913.

A method and apparatus for forming an electrically and/or thermally conducting interconnection is disclosed wherein a first surface and a second surface are contacted with each other via a plurality of nanostructures disposed on at least one of the surfaces. In one embodiment, a first plurality of areas of nanostructures is disposed on a component in an electronics package such as, illustratively, a microprocessor. The first plurality of areas is then brought into contact with a corresponding second plurality of areas of nanostructures on a substrate, thus creating a strong friction bond. In another illustrative embodiment, a plurality of nanostructures is disposed on a component, such as a microprocessor, which is then brought into contact with a substrate. Intermolecular forces result in an attraction between the molecules of the nanostructures and the molecules of the substrate, thus creating a bond between the nanostructures and the substrate.

  Recently Added Patents
LED lamp for producing biologically-corrected light
Media stand
Semiconductor film, method for manufacturing the same, and power storage device
Steering apparatus for turning multiple sets of steerable vehicle wheels
One-step synthesis of monodisperse AU-CU nanocubes
Single-power-transistor battery-charging circuit using voltage-boosted clock
Foamable low-viscosity mixtures
  Randomly Featured Patents
Swinging assembly for cribs
System and method for detecting and processing stale messages
Dual polarization amplifier
Method for operating a combined multimedia-telecom system
Isoxazoline fibrinogen receptor antagonists
Method of deinking waste paper for reclamation thereof
Adjustable multi-purpose hand tool
Ventricular assist device
Three dimensional semiconductor integrated circuit device having a piercing electrode
Window lock