Resources Contact Us Home
High density nanostructured interconnection

Image Number 4 for United States Patent #7402913.

A method and apparatus for forming an electrically and/or thermally conducting interconnection is disclosed wherein a first surface and a second surface are contacted with each other via a plurality of nanostructures disposed on at least one of the surfaces. In one embodiment, a first plurality of areas of nanostructures is disposed on a component in an electronics package such as, illustratively, a microprocessor. The first plurality of areas is then brought into contact with a corresponding second plurality of areas of nanostructures on a substrate, thus creating a strong friction bond. In another illustrative embodiment, a plurality of nanostructures is disposed on a component, such as a microprocessor, which is then brought into contact with a substrate. Intermolecular forces result in an attraction between the molecules of the nanostructures and the molecules of the substrate, thus creating a bond between the nanostructures and the substrate.

  Recently Added Patents
Clusterin antisense therapy for treatment of cancer
Digital image processing device and processing method thereof
Digital broadcasting system and method of processing data in digital broadcasting system
Optical multiplexer/demultiplexer
Highly specialized application protocol for email and SMS and message notification handling and display
Polymer composites having highly dispersed carbon nanotubes
Spark plug
  Randomly Featured Patents
Artificial vertebral disk replacement implant with crossbar spacer and method
Assembly tape with perforation and expansion reserve
Apparatus and method of forming a continuous layer of thermoplastic material
User interface system and method for traversing a database
Memory devices including spacer-shaped electrodes on pedestals and methods of manufacturing the same
Fishing reel
Semiconductor device including uniform contact plugs and a method of manufacturing the same
Chromogenic propenylenesulfone compounds
Line scan sequential lateral solidification of thin films
Wire printhead with armature biasing mechanism