Resources Contact Us Home
Carrier for test, burn-in, and first level packaging

Image Number 3 for United States Patent #7394268.

A plurality of semiconductor devices are provided on a carrier for testing or burning-in. The carrier is then cut up to provide single chip-on-carrier components or multi-chip-on-carrier components. The carrier is used as a first level package for each chip. Thus, the carrier serves a dual purpose for test and burn-in and for packaging. A lead reduction mechanism, such as a built-in self-test engine, can be provided on each chip or on the carrier and is connected to contacts of the carrier for the testing and burn-in steps. The final package after cutting includes at least one known good die and may include an array of chips on the carrier, such as a SIMM or a DIMM. The final package can also be a stack of chips each mounted on a separate carrier. The carriers of the stack are connected to each other through a substrate mounted along a side face of the stack that is electrically connected to a line of pads along an edge of each carrier.

  Recently Added Patents
Electronic package with fluid flow barriers
Battery loading and unloading mechanism
Vehicle motion control device
System, method, and computer readable medium for a force-based wheelchair joystick
Managing distributed applications using structural diagrams
Vehicle detection apparatus and method using magnetic sensor
Nuclear fission reactor, a vented nuclear fission fuel module, methods therefor and a vented nuclear fission fuel module system
  Randomly Featured Patents
Transverse leaf spring type suspension
Displayable indicia box
Floor mat
Test structure and related methods for evaluating stress-induced voiding
Beacon data acquisition and display system
Post and sleeve arrangement
Copying machine control mechanism
Propulsion system for yachts, trawlers and the like
Remote controller