Resources Contact Us Home
Carrier for test, burn-in, and first level packaging

Image Number 3 for United States Patent #7394268.

A plurality of semiconductor devices are provided on a carrier for testing or burning-in. The carrier is then cut up to provide single chip-on-carrier components or multi-chip-on-carrier components. The carrier is used as a first level package for each chip. Thus, the carrier serves a dual purpose for test and burn-in and for packaging. A lead reduction mechanism, such as a built-in self-test engine, can be provided on each chip or on the carrier and is connected to contacts of the carrier for the testing and burn-in steps. The final package after cutting includes at least one known good die and may include an array of chips on the carrier, such as a SIMM or a DIMM. The final package can also be a stack of chips each mounted on a separate carrier. The carriers of the stack are connected to each other through a substrate mounted along a side face of the stack that is electrically connected to a line of pads along an edge of each carrier.

  Recently Added Patents
Spread spectrum communication system and transmission power control method therefor
Artificial engine sound control unit, approaching vehicle audible system, and electric vehicle having them
Glycosyltransferase promoter
Techniques to manage communications resources for a multimedia conference event
Methods of saccharification of polysaccharides in plants
Circuit arrangement having a load transistor and a voltage limiting circuit and method for driving a load transistor
Forming agent for gate insulating film of thin film transistor
  Randomly Featured Patents
Multifunctional cellular modem for aircraft computing devices
Electronics package that has a substrate with an array of hollow vias and solder balls that are eccentrically located on the vias
Drinking glass
Tracking details of activation of licensable component of consumer electronic device
On-chip spectral filtering using CCD array for imaging and spectroscopy
Micro-volume, Curie-Point pyrolysis/desorption apparatus
Method for producing porous ceramic article
Electronic device adaptive to mounting on a printed wiring board
Protocol method for validating an input protocol specification
Soft fabric book with high resolution images and method of making same