Resources Contact Us Home
Method of manufacturing a semiconductor device

Image Number 14 for United States Patent #7384820.

A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.

  Recently Added Patents
Ion generation using wetted porous material
Routing of data including multimedia between electronic devices
Position pointer, variable capacitor and inputting apparatus
Atmospheric treater with roller confined discharge chamber
Printing apparatus
System and method for storing redundant information
System and method for multi-tiered meta-data caching and distribution in a clustered computer environment
  Randomly Featured Patents
Vertical installation system in which information processing apparatuses are installed
Double wave stent with strut
Trench cutter for excavating trenches and for laying water pipes and drainage pipes
Drinking glass
Attachment device for pliant material
Spray compositions
Saturation contrast image enhancement
Proton exchange membranes for fuel cell applications
Method for manufacturing probe structure
Liquid dispensing apparatus