Resources Contact Us Home
Method of fabricating vertical structure compound semiconductor devices

Image Number 5 for United States Patent #7384807.

A method of fabricating a vertical structure opto-electronic device includes fabricating a plurality of vertical structure opto-electronic devices on a crystal substrate, and then removing the substrate using a laser lift-off process. The method then fabricates a metal support structure in place of the substrate. In one aspect, the step of fabricating a metal support structure in place of the substrate includes the step of plating the metal support structure using at least one of electroplating and electro-less plating. In one aspect, the vertical structure is a GaN-based vertical structure, the crystal substrate includes sapphire and the metal support structure includes copper. Advantages of the invention include fabricating vertical structure LEDs suitable for mass production with high reliability and high yield.

  Recently Added Patents
Electronic device including predicted frequency error estimation of a voltage controlled oscillator and related methods
Vehicle driving assistance apparatus
Method and apparatus for visual neural stimulation
Double patterning method using tilt-angle deposition
Method of fabricating semiconductor light emitting device
Image forming apparatus and image forming method
Methods and systems for use in tracking targets for direction finding systems
  Randomly Featured Patents
Leak detecting cable
Desulfurization of iron oxide pellets
Trim articles with invisible tear seams and methods of making the same
Roofing seam installation process and products for the production of a seamed roof
Bridged electromechanical filters
Synthetic peptides for diagnosis and prevention of influenza virus infection and their use
Method of forming large-sized aluminum alloy product
Tipless can filling valve
Device for mounting an air-flow dividing wall in a turbojet engine afterburner