Resources Contact Us Home
Method of fabricating vertical structure compound semiconductor devices

Image Number 5 for United States Patent #7384807.

A method of fabricating a vertical structure opto-electronic device includes fabricating a plurality of vertical structure opto-electronic devices on a crystal substrate, and then removing the substrate using a laser lift-off process. The method then fabricates a metal support structure in place of the substrate. In one aspect, the step of fabricating a metal support structure in place of the substrate includes the step of plating the metal support structure using at least one of electroplating and electro-less plating. In one aspect, the vertical structure is a GaN-based vertical structure, the crystal substrate includes sapphire and the metal support structure includes copper. Advantages of the invention include fabricating vertical structure LEDs suitable for mass production with high reliability and high yield.

  Recently Added Patents
Use of a high-oleic and high-tocol diet in combination with a non-tocol antioxidant for improving animal meat quality
Lookup front end packet input processor
Optical module for a microlithography objective including holding and supporting devices
Method and system for filtering home-network content
Electronic device with multi-orientation
Adding co-users to user definable co-user lists
Image forming apparatus
  Randomly Featured Patents
Automated path verification for SHN-based restoration
Upholstered seat for clean rooms
Wireless optical input device
Mechanism for locking out improperly inserted cartridge
Headlight for a vehicle
Enhanced countermeasures for all-digital line-of-sight (LOS) processor
Retaining wall block system and method with varying block face sizes
Method of coating a fishing fly and a fishing fly coated thereby
Gas atmosphere heating furnace