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Structured ASIC device with configurable die size and selectable embedded functions










Image Number 3 for United States Patent #7337425.

One embodiment of the present invention provides for a master or universal base and base tooling which addresses the general purpose Structured ASIC requirements. Another embodiment of the present invention provides for a common set of base tooling from which the master/universal base is created as well as additional custom bases with customized selection and quantity of embedded Platform ASIC functions. Embodiments can utilize conventional Structured ASIC architecture and processing and are compatible with traditional probing and packaging.








 
 
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