Resources Contact Us Home
Structured ASIC device with configurable die size and selectable embedded functions

Image Number 15 for United States Patent #7337425.

One embodiment of the present invention provides for a master or universal base and base tooling which addresses the general purpose Structured ASIC requirements. Another embodiment of the present invention provides for a common set of base tooling from which the master/universal base is created as well as additional custom bases with customized selection and quantity of embedded Platform ASIC functions. Embodiments can utilize conventional Structured ASIC architecture and processing and are compatible with traditional probing and packaging.

  Recently Added Patents
Secure mobile ad hoc network
Acrylic pressure-sensitive adhesive composition, acrylic pressure-sensitive adhesive layer, and acrylic pressure-sensitive adhesive tape
Method and apparatus for receiving signals in a MIMO system with multiple channel encoders
Isolated SCR ESD device
Holding structure for a touch panel
Method and apparatus of communication using soft decision
  Randomly Featured Patents
Oscillator circuit with a voltage restriction block
Apparatus and method for measuring an environmental condition
Network congestion analysis
Premixing burner for generating an ignitable fuel/air mixture
Digital convergence system for a multi-gun CRT
Injection molding die
Measuring distances using a plurality of frequencies
Metering unit for liquid magnesium
Secondary circulation cooling system
Device and a method of connecting an electrical power line between a ship and a terminal