Resources Contact Us Home
Method for forming damascene structure utilizing planarizing material coupled with compressive diffusion barrier material

Image Number 6 for United States Patent #7326651.

This invention relates to the manufacture of dual damascene interconnect structures in integrated circuit devices. Specifically, a method is disclosed for forming a single or dual damascene structure in a low-k dielectric thin film utilizing a planarizing material and a compressive diffusion barrier material. The barrier material preferably has a compressive stress of greater than 300 MPa. In a preferred dual damascene embodiment of this method, the vias are formed first in the dielectric material, then the planarizing material is deposited in the vias and on the dielectric material, and the barrier material is deposited on the planarizing material. The trenches are then formed lithographically in the imaging material, etched through the barrier material into the planarizing material, and the trench pattern is transferred to the dielectric material. During and following the course of these etch steps, the imaging, barrier and planarizing materials are removed. The resultant dual damascene structure may then be metallized. With this method, the problem of photoresist poisoning by the interlevel dielectric material is alleviated.

  Recently Added Patents
Dynamic report mapping apparatus to physical data source when creating report definitions for information technology service management reporting for peruse of report definition transparency a
Molded surface of a concrete product
Apparatus and method for providing vehicle data for testing product
Triple-action pest control formulation and method
Adaptive switch mode LED system
Arrays of optical confinements and uses thereof
Perception-based artifact quantification for volume rendering
  Randomly Featured Patents
System and method for measuring properties of a semiconductor substrate in a fabrication line
Switching telephone calls between wireline and cellular telephones
Spectral coding by fluorescent semiconductor nanocrystals for document identification and security applications
Urinary incontinence therapy
Device for preparing mixtures for dissolving dyes in powder form in textile plants
Replaceable drill bit assembly
Method of making a short pulse cable for electrical power transmission
Digital wrist watch
Damper mechanism
Three-dimensional stacked semiconductor package with pillars in pillar cavities