Resources Contact Us Home
Method for creating a mold for a knee brace and a knee brace

Image Number 16 for United States Patent #7311866.

Disclosed is a method for producing a three-dimensional composite structure and a method for producing the mold for the three-dimensional composite structure. The mold is formed of at least one rigid die member and a second thermoplastic die member. The second thermoplastic die member is formed by coupling a rubber flexible pattern to a surface of the first die member. Vacuum or pressure is applied to a heated thermoplastic sheet to cause the heated thermoplastic sheet to deform about the flexible pattern, thereby forming the second die. Strips of reinforced polymer thermoset pre-preg material are then positioned within the cavities formed by the flexible pattern and are allowed to cure. Optionally, heat, pressure, and vacuum may be applied to the mold construction to facilitate the curing of the thermoset materials.

  Recently Added Patents
Method to trace video content processed by a decoder
Mobile terminal device capable of more effectively utilizing operation portions, conductive portion, operation detecting unit, power supply unit, and signal processing unit
Personalized health communication system
Selective thermal treatment of medical instrument portions with thermal treatment system instrument holder
Electronic device with embedded antenna
Interactivity model for shared feedback on mobile devices
Biodegradable aliphatic-aromatic copolyester for use in nonwoven webs
  Randomly Featured Patents
Process of forming compounds using reverse micelle or reverse microemulsion systems
Image segmentation using spatial random walks
Exhaust vent adapter for a clothes dryer
Magnetic control of spacecraft roll disturbance torques
Apparatus and method for switching between single user and multi-user MIMO operation in a wireless network
Backpack with incorporated gun scabbard
Device for moving loads
Method and apparatus for cutting rings from forging stock
Temperature-controlled support for semiconductor wafer