Resources Contact Us Home
Method of manufacturing microdischarge devices with encapsulated electrodes

Image Number 6 for United States Patent #7297041.

A method for fabricating dielectric encapsulated electrodes. The process includes anodizing a metal to form a dielectric layer with columnar micropores; dissolving a portion of the dielectric layer and then anodizing the resultant structure a second time. The nanoporous structure that results can provide properties superior to those of conventional dielectric encapsulated metals. The pores of the dielectric may be backfilled with one or more materials to further tailor the properties of the dielectric.

  Recently Added Patents
Antitumoral compounds
Active and progressive targeted advertising
Retransmission and retransmission request in data communication systems
Systems and methods for dissipating an electric charge while insulating a structure
Multi-port, gigabit SERDES transceiver capable of automatic fail switchover
Illuminating waveguide fabrication method
  Randomly Featured Patents
Efficient memory usage for unified document object model implementation for Java
Bioreactor for the manufacture of tissue engineered blood vessels
Base station antenna arrangement
Cover for a transport refrigeration system
Substituted phenylcyclohexanecarboxamides and their use
Scrapbook shaped as a purse
Electrical extension cord plug and receptacle
Apparatus and method for selectively determining orientation of dough pieces
Elastomeric glove with silicone coating
Seating system and assembly