Resources Contact Us Home
Method of manufacturing microdischarge devices with encapsulated electrodes

Image Number 6 for United States Patent #7297041.

A method for fabricating dielectric encapsulated electrodes. The process includes anodizing a metal to form a dielectric layer with columnar micropores; dissolving a portion of the dielectric layer and then anodizing the resultant structure a second time. The nanoporous structure that results can provide properties superior to those of conventional dielectric encapsulated metals. The pores of the dielectric may be backfilled with one or more materials to further tailor the properties of the dielectric.

  Recently Added Patents
Pet fish burial pod
Philanthropy management apparatus, system, and methods of use and doing business
Multi-chip package with a supporting member and method of manufacturing the same
Method of manufacturing semiconductor devices using ion implantation
Device for preparing a body fluid for a bacteriological analysis
Peer-to-peer method of deploying and managing executable code and associated plug-ins
Printed circuit board including electromagnetic bandgap structure
  Randomly Featured Patents
Blood collection tube assembly
Combustion unit
Vibration damper for overhead conductors
Nonvolatile memory and method of controlling thereof
Tank device for flushing toilet bowl
Method, system and computer readable recording medium for correcting OCR result
Compact trace element sensor which utilizes microwave generated plasma and which is portable by an individual
Service delivery online
Semiconductor device encapsulated with a flame retardant epoxy molding compound
Semiconductor texturing process