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Process for treating substrates for the microelectronics industry, and substrates obtained by this process










Image Number 4 for United States Patent #7288418.

A process for treating substrates for the microelectronics or optoelectronics industry, wherein the substrates include on at least one of their faces a working layer in which components are intended to be formed. The process includes a step of annealing under a reductive atmosphere followed by a step of chemical-mechanical polishing on the free surface of the working layer.








 
 
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