Image Number 3 for United States Patent #7285791.
A wavelength conversion chip is formed by depositing a wavelength conversion material layer on a substrate, segmenting the wavelength conversion layer into a plurality of wavelength conversion chips, and then removing the wavelength conversion chips from the substrate. The wavelength conversion of the chips can be increased by thermal annealing or radiation annealing of the wavelength conversion material. Optical coatings or light extraction elements can be fabricated on the wavelength conversion layer.
|
