Resources Contact Us Home
Method of fabricating isolated semiconductor devices in epi-less substrate

Image Number 13 for United States Patent #7276431.

An structure for electrically isolating a semiconductor device is formed by implanting dopant into a semiconductor substrate that does not include an epitaxial layer. Following the implant the structure is exposed to a very limited thermal budget so that dopant does not diffuse significantly. As a result, the dimensions of the isolation structure are limited and defined, thereby allowing a higher packing density than obtainable using conventional processes which include the growth of an epitaxial layer and diffusion of the dopants. In one group of embodiments, the isolation structure includes a deep layer and a sidewall which together form a cup-shaped structure surrounding an enclosed region in which the isolated semiconductor device may be formed. The sidewalls may be formed by a series of pulsed implants at different energies, thereby creating a stack of overlapping implanted regions.

  Recently Added Patents
Heterocyclic compounds as CCR2B antagonists
Antenna device
Managing deduplication density
Printing system, information processing apparatus, print job processing method, information processing method, program, and storage medium
Determining system for localization methods combination
Microbial fuel cell and method of use
  Randomly Featured Patents
Optical entertainment of amusement structure and device
Electro-optic thin-film waveguide modulator device
Method and apparatus for fast W-CDMA acquisition
Process for the synthesis of diaminopyridines from glutaronitriles
Method and system for extended network access notification via a broadband access gateway
Method of forming opening on semiconductor substrate
Ink-jet recording apparatus and method of preventing clogging of nozzle discharging ink
Reduction of nonspecific hybridization by using novel base-pairing schemes
Palm held liquid and lotion applicator
Transponder bolt seal and a housing for a transponder