Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Semiconductor device and method of manufacturing the same










Image Number 6 for United States Patent #7271487.

The present invention is to improve yield and reliability in a wiring step of a semiconductor device. When an Al wiring on an upper layer is connected through an connection pillar onto an Al wiring on a lower layer embedded in a groove formed on an interlayer insulation film, a growth suppression film having an opening whose width is wider than that of the Al wiring is formed on the interlayer insulation film and the Al wiring. In this condition, Al and the like are grown by a selective CVD method and the like. Accordingly, the connection pillar is formed on the Al wiring within the opening, in a self-matching manner with respect to the Al wiring.








 
 
  Recently Added Patents
Vapor phase decarbonylation process
Electrode tab for secondary battery and secondary battery using the same
System and methods for facilitating and documenting user thinking and learning using enhanced interactive constructs
Handbag
Sitagliptin intermediate compounds, preparation methods and uses thereof
Semiconductor device, semiconductor device design method, semiconductor design apparatus, and program
Navigation device, navigation method, and navigation program
  Randomly Featured Patents
Audio coder
LED exit light fixture
Remote synchronization in packet-switched networks
Digital certificate management system, digital certificate management apparatus, digital certificate management method, update procedure determination method and program
Altitude correction for aircraft under non-ISA temperature conditions
Sealing of void area at the top of cup bead of hot melt
Process and equipment for lifting secondary liquids with the energy of primary liquids
Preparation of fluoronitrobenzene
Well test system to control well processes based on quantity measurements
Process for preparing a dried agglomerated cereal mixture