Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers










Image Number 14 for United States Patent #7265330.

Microelectronic imager assemblies comprising a workpiece including a substrate and a plurality of imaging dies on and/or in the substrate. The substrate includes a front side and a back side, and the imaging dies comprise imaging sensors at the front side of the substrate and external contacts operatively coupled to the image sensors. The microelectronic imager assembly further comprises optics supports superimposed relative to the imaging dies. The optics supports can be directly on the substrate or on a cover over the substrate. Individual optics supports can have (a) an opening aligned with one of the image sensors, and (b) a bearing element at a reference distance from the image sensor. The microelectronic imager assembly can further include optical devices mounted or otherwise carried by the optics supports.








 
 
  Recently Added Patents
Rechargeable battery
Method of fabricating solid electrolytic capacitor and solid electrolytic capacitor
Turbulence sensor and blade condition sensor system
Method and system for expanding axial coverage in iterative reconstruction in computer tomography (CT)
Method for fabricating solar cell
Buckle
Method and apparatus for a battery docking connector having reserve power for hot battery swap
  Randomly Featured Patents
High performance triangle interpolator
Fused pyrazole derivatives being protein kinase inhibitors
Apparatus and method for performing ligand binding assays on microarrays in multiwell plates
Thermal mass flow meter including heating element and temperature sensors formed on separate chips and secured to the outer periphery of the pipe
Phase-coherent FSK signal demodulator
Metal hydride storage canister design and its manufacture
Optical fiber connector
Trip indicator
Active matrix liquid crystal panel having an active layer and an intervening layer formed of a common semiconductor film
Injection mold