Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Interface engineering to improve adhesion between low k stacks










Image Number 3 for United States Patent #7259111.

A method of depositing a organosilicate dielectric layer exhibiting high adhesion strength to an underlying substrate disposed within a single processing chamber without plasma arcing. The method includes positioning a substrate within a processing chamber having a powered electrode, flowing an interface gas mixture into the processing chamber, the interface gas mixture comprising one or more organosilicon compounds and one or more oxidizing gases, depositing a silicon oxide layer on the substrate by varying process conditions, wherein DC bias of the powered electrode varies less than 60 volts.








 
 
  Recently Added Patents
Notebook computer
Di and tri- substituted oxathiazine derivatives, method for the production, method for the production thereof, use thereof as medicine and drug containing said derivatives and use thereof
Method, base station and system for adjusting cell wireless configuration parameter
Antibodies to CCR2
System for alarming upon occurrence of secession of smart key for vehicles
Ionic compound, anti-static pressure-sensitive adhesive and polarizer comprising the same
Image manipulating system and method
  Randomly Featured Patents
Rotational torque detection mechanism and power steering apparatus
Stepping motor
Hypotube hub
Process for the preparation of perfluorinated ethers
Removable, transparent, colored key caps for color coding a keyboard
Rotary conveyor tine stripper
Vascular sheath with bioabsorbable puncture site closure apparatus and methods of use
System and method for facilitating a ready social network
Housing for a mobile computing device
Combined ceiling fan motor housing and fan blade bracket