Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method of producing a semiconductor device having a multi-layered insulation film










Image Number 6 for United States Patent #7229910.

The object of the present invention is to improve the interfacial adhesion between the film with low dielectric constant and protective film, without damaging the excellent dielectric, flatness and gap-filling characteristics of the organic material of low dielectric constant, and for that purpose there is provided a wiring structure with the copper film embedded in the insulation film of the wiring layer, wherein the insulation film of the wiring layer is of a multi-layered structure with the laminated methyl silisesquioxane (MSQ) film, methylated hydrogen silisesquioxane (MHSQ) film and silicon oxide film.








 
 
  Recently Added Patents
Digital watermark embedding apparatus, digital watermark embedding method, and digital watermark detection apparatus
Digital broadcasting system and method of processing data
Control device for radiation imaging apparatus and control method therefor
Method and system for routing telephony communications together with modified calling party identifier information
Method and apparatus for wireless transmission of diagnostic information
Ice data collection system
Routing of data including multimedia between electronic devices
  Randomly Featured Patents
High pigment golden beets
Benzotriazole adduct and lubricant compositions containing said adduct
Filtration and purification method for aqueous acids
Fare card read-writer which overwrites oldest or invalid data
Liquid ejection head and image forming apparatus comprising same
Automated work transfer system for chemical processing baths
Multi-vehicle automatic transmission fluid
Impregnation of electrodes for nickel cadmium batteries
Transient episode detector method and apparatus
Toothbrush chair