Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method of producing a semiconductor device having a multi-layered insulation film










Image Number 6 for United States Patent #7229910.

The object of the present invention is to improve the interfacial adhesion between the film with low dielectric constant and protective film, without damaging the excellent dielectric, flatness and gap-filling characteristics of the organic material of low dielectric constant, and for that purpose there is provided a wiring structure with the copper film embedded in the insulation film of the wiring layer, wherein the insulation film of the wiring layer is of a multi-layered structure with the laminated methyl silisesquioxane (MSQ) film, methylated hydrogen silisesquioxane (MHSQ) film and silicon oxide film.








 
 
  Recently Added Patents
Method and apparatus for radio antenna frequency tuning
Gateway channel utilization
Switching device, switch control method, and storage system
Method and system for blocking hazardous information
Image-processing method and program, and image-processing apparatus
Method and system for cooling of integrated circuits
Sink
  Randomly Featured Patents
Footwear upper
Electrical metallic tube, coupling, and connector apparatus and method
Housing for encasing an object
Strain of Corynebacterium Fascians and use thereof to reduce limonoid bitterness in citrus products
Image forming apparatus with end of operating lifetime controller
Phase lock loop carrier generator for receiver of phase modulated carrier pulse signals
Battery cable clamp
Electric generator incorporating exhaust heat recovery device
Circuit for and method of generating a frequency aligned clock signal
Strength (UCS) of carbonates using compressional and shear acoustic velocities