Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method of producing a semiconductor device having a multi-layered insulation film










Image Number 6 for United States Patent #7229910.

The object of the present invention is to improve the interfacial adhesion between the film with low dielectric constant and protective film, without damaging the excellent dielectric, flatness and gap-filling characteristics of the organic material of low dielectric constant, and for that purpose there is provided a wiring structure with the copper film embedded in the insulation film of the wiring layer, wherein the insulation film of the wiring layer is of a multi-layered structure with the laminated methyl silisesquioxane (MSQ) film, methylated hydrogen silisesquioxane (MHSQ) film and silicon oxide film.








 
 
  Recently Added Patents
Method of making a CIG target by cold spraying
Liquid crystal display
Lightweight multicast method and apparatus for data distribution service
System for providing access to playable media
Egg separator
Testing apparatus and testing method for telephone apparatus
Liquid crystal display and manufacturing method thereof
  Randomly Featured Patents
Speed control apparatus
Flat display apparatus with spacers between first panel substrate and second panel substrate, and method of manufacturing the same
Continuous feed shaft retort process for recovery of non-ferrous metals from process dust
Signal delay skew reduction system
Frosted terry cloth and method for producing same
Sorter-finisher provided for an image forming apparatus
Automatic path selection for fiber-optic transmission networks
Spacecraft attitude control using coupled thrusters
Apparatus for applying a viscous lotion
Blender