Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method of producing a semiconductor device having a multi-layered insulation film










Image Number 6 for United States Patent #7229910.

The object of the present invention is to improve the interfacial adhesion between the film with low dielectric constant and protective film, without damaging the excellent dielectric, flatness and gap-filling characteristics of the organic material of low dielectric constant, and for that purpose there is provided a wiring structure with the copper film embedded in the insulation film of the wiring layer, wherein the insulation film of the wiring layer is of a multi-layered structure with the laminated methyl silisesquioxane (MSQ) film, methylated hydrogen silisesquioxane (MHSQ) film and silicon oxide film.








 
 
  Recently Added Patents
Apparatus and method for generating compressive measurements of video using spatial and temporal integration
Multiport passive device for sharing optical signals
Photovoltaic device and manufacturing method thereof
Generating recommendations of points of interest
System and method for adaptive text recommendation
Propulsion device for automobile with portal axle comprising an electrical machine
Building roof fascia, coping and/or solar panel connector arrangement
  Randomly Featured Patents
Slide-type portable terminal
Method for improving cellulose fiber
Resistive memory
Continuous in situ fiberization substrate material mechanism
Pillow
Combining frequency warping and spectral shaping in HMM based speech recognition
System and method for automatic digital certificate installation on a network device in a data-over-cable system
Tremolo device for stringed instruments
Multiple lumen catheter
Slidable door closure and hanger system for passenger vehicle