Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method of producing a semiconductor device having a multi-layered insulation film










Image Number 6 for United States Patent #7229910.

The object of the present invention is to improve the interfacial adhesion between the film with low dielectric constant and protective film, without damaging the excellent dielectric, flatness and gap-filling characteristics of the organic material of low dielectric constant, and for that purpose there is provided a wiring structure with the copper film embedded in the insulation film of the wiring layer, wherein the insulation film of the wiring layer is of a multi-layered structure with the laminated methyl silisesquioxane (MSQ) film, methylated hydrogen silisesquioxane (MHSQ) film and silicon oxide film.








 
 
  Recently Added Patents
Molded surface of a concrete product
Methods and systems for assessing sales activity of a merchant
Deposition apparatus and method for manufacturing organic light emitting diode display using the same
Automated difference recognition between speaking sounds and music
Pharmaceutical dosage form
Photographic printing paper and method of making same
Weight-balanced polygonal mirror, light scanning unit using the polygonal mirror, and image forming apparatus
  Randomly Featured Patents
Digitally controlled current regulator for high power solid state lighting
High-energy explosive or propellant
Image forming method
Process for electrolytically dyeing an anodic oxide layer on aluminum or aluminum alloys
Rake machine
Download and processing of a network management application on a network device
High frequency plasma generator and high frequency plasma generating method
CRT display device to suppress electromagnetic radiation therefrom
Magneto-optical recording medium
Rapid detection of isoniazid resistance in mycobacterium tuberculosis probes for selecting nucleic acid encoding isoniazid resistance, and methods and kits