Resources Contact Us Home
Integrated circuit cooling system and method

Image Number 9 for United States Patent #7202562.

A system and method for cooling an integrated circuit is provided. One aspect of this disclosure relates to a cooling system that utilizes sound waves to cool a semiconductor structure. The system includes a container to hold at least one semiconductor chip having surfaces to be in contact with a fluid. The system also includes a transducer and a heat exchanger disposed within the container and operably positioned with respect to each other to perform a thermoacoustic cooling process. In this system, the transducer is adapted to generate sound waves within the fluid such that compression and decompression of the fluid provides a temperature gradient across the semiconductor chip to transfer heat from the semiconductor chip to the heat exchanger, and the heat exchanger is adapted to remove heat from the fluid in the container. Other aspects and embodiments are provided herein.

  Recently Added Patents
Transmission electron microscope and method of operating a transmission electron microscope
Catalytic cracking catalyst compositions having improved bottoms conversion
Phase-locked loop having a constant damping ratio
Fluid control system for steerable agricultural implement
Technique to share information among different cache coherency domains
Light emitting device having a plurality of light emitting cells and package mounting the same
Stringed instrument bending stress relief
  Randomly Featured Patents
Earthquake-resistant electronic equipment frame
Speaker system
Spark plug having a particular resistor
Optical apparatus
Intake silencer
Object awareness determination system and a method for determining awareness of an object
Optical glass
Synthesis of soluble functionalized lithium initiators
Polycarbonate compositions
Portable integrated indoor and outdoor positioning system and method