Resources Contact Us Home
Integrated circuit cooling system and method

Image Number 9 for United States Patent #7202562.

A system and method for cooling an integrated circuit is provided. One aspect of this disclosure relates to a cooling system that utilizes sound waves to cool a semiconductor structure. The system includes a container to hold at least one semiconductor chip having surfaces to be in contact with a fluid. The system also includes a transducer and a heat exchanger disposed within the container and operably positioned with respect to each other to perform a thermoacoustic cooling process. In this system, the transducer is adapted to generate sound waves within the fluid such that compression and decompression of the fluid provides a temperature gradient across the semiconductor chip to transfer heat from the semiconductor chip to the heat exchanger, and the heat exchanger is adapted to remove heat from the fluid in the container. Other aspects and embodiments are provided herein.

  Recently Added Patents
Probiotic enriched and low organic acid food products
Oral care implement accessory
Dental fillers including a phosphorus containing surface treatment, and compositions and methods thereof
Enediyne compounds, conjugates thereof, and uses and methods therefor
Egg separator
Communication terminal device, communication system, and communication control method
Sitagliptin intermediate compounds, preparation methods and uses thereof
  Randomly Featured Patents
Purified nitric oxide synthase
Dispersions containing pyrogenic oxides
System and method for pendant bus for serially chaining multiple portable pendant peripherals
Target stand
Data distribution method
Lateral high-voltage transistor
Headset for portable phone
Container handling and transporting apparatus
Alignment system for laser communication beam
Gait producing device for moving robot