Resources Contact Us Home
Integrated circuit cooling system and method

Image Number 9 for United States Patent #7202562.

A system and method for cooling an integrated circuit is provided. One aspect of this disclosure relates to a cooling system that utilizes sound waves to cool a semiconductor structure. The system includes a container to hold at least one semiconductor chip having surfaces to be in contact with a fluid. The system also includes a transducer and a heat exchanger disposed within the container and operably positioned with respect to each other to perform a thermoacoustic cooling process. In this system, the transducer is adapted to generate sound waves within the fluid such that compression and decompression of the fluid provides a temperature gradient across the semiconductor chip to transfer heat from the semiconductor chip to the heat exchanger, and the heat exchanger is adapted to remove heat from the fluid in the container. Other aspects and embodiments are provided herein.

  Recently Added Patents
Graphical user interface for interpreting the results of image analysis
Systems and methods for authorizing, authenticating and accounting users having transparent computer access to a network using a gateway device
Pipe coupling
LED lamp including heat dissipator
Organic compounds
Power consumption management in a MIMO transceiver and method for use therewith
  Randomly Featured Patents
Ironing board
Process for the production of fatty alcohols
Putter training apparatus and method of use
Distributed light sources and systems for photo-reactive curing
Chip level hermetic and biocompatible electronics package using SOI wafers
Method for attaching resonator part
Floor panel for a clean room
Fungicidal acyl anilides
Cushioned railway car center plate assembly
Torque measure device