Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Semiconductor device










Image Number 18 for United States Patent #7199472.

In a semiconductor device having the upmost wiring layer comprised of aluminum and the wiring layer immediately below it comprised of copper, the upmost wiring layer is made thicker than the wiring layer immediately below it so that the upmost wiring layer is lower in sheet resistance than the wiring layer immediately below it. Multiple ring power lines VR and pads PD are formed of the upmost wiring layer, and the ring power lines VR and the pads PD are connected respectively through power lines VLB1 of the upmost wiring layer. Consequently, the voltage drop on the power feed path from the pads PD to the ring power lines VR can be reduced and the power conduction from the pads PD to the ring power lines VR can be stabilized.








 
 
  Recently Added Patents
Method for production of a thermoelectric apparatus
Single-wavelength correction method for luminescent homogeneous biological assay
Methods and apparatus for low power out-of-band communications
Petunia plant named `Bartpet001`
Aspect ratio enhancement
Fixing apparatus
System and method for creating, managing and trading hedge portfolios
  Randomly Featured Patents
Method and apparatus for a latchable and pluggable electronic and optical module
Metal working attachment for portable power tool
Plasma display panel with infrared absorbing coating
Apparatus for testing system-on-chip
Solubilizers containing alk(en)yl oligoglycosides and polyol components, and methods of solubilizing using the same
Radial attenuation
Golf swing practice device
Wireless communications system, wireless terminal device, indoor base station apparatus, and control apparatus for obtaining location information
Injection method for administering microparticles containing active substances to plants
Speaker