Resources Contact Us Home
Semiconductor manufacturing device and semiconductor manufacturing method

Image Number 4 for United States Patent #7141995.

A semiconductor manufacturing device includes a prober whose needles are at once engaged for contacting pads of two chip forming regions within a wafer. In one chip forming region, trimming is performed, while in the other chip forming region, inspecting posterior to trimming is performed.

  Recently Added Patents
System for hot-start amplification via a multiple emulsion
Device chip carriers, modules, and methods of forming thereof
Use of natriuretic peptide for treating heart failure
Cable sheath
Fluorescent dyes, fluorescent dye kits, and methods of preparing labeled molecules
System for the secure management of digitally controlled locks, operating by means of crypto acoustic credentials
Portable gaming device and gaming system combining both physical and virtual play elements
  Randomly Featured Patents
Composite cathode materials for solid state batteries
Code synchronization
Adaptive recording band expansion methodology
Axial mounting with skewing compensation
Adhesive transfer apparatus
Highly concentrated oil-in-water silicone emulsions
Method and composition for inhibiting corrosion of ferrous metals by aqueous brines
Communication system for information exchange between master and slave stations using frames having organization, request and communication channels
Burst mode digital data amplifier circuit unit and amplifier circuit
1-substituted-2-(3-amino-1-propynyl)pyrrolidine derivatives