Resources Contact Us Home
Semiconductor manufacturing device and semiconductor manufacturing method

Image Number 4 for United States Patent #7141995.

A semiconductor manufacturing device includes a prober whose needles are at once engaged for contacting pads of two chip forming regions within a wafer. In one chip forming region, trimming is performed, while in the other chip forming region, inspecting posterior to trimming is performed.

  Recently Added Patents
Unified recovery
Cross-linkable compositions
High performance strained source-drain structure and method of fabricating the same
Power conversion device for electric vehicle
Vacuum switch and electrode assembly therefor
Commissioning incoming packet switched connections
Extensible, filtered lists for mobile device user interface
  Randomly Featured Patents
Porous composite product particularly with high specific surface area, method for preparing and electrode for electrochemical assembly formed with a porous composite film
Process for air-blown gasification of carbon-containing fuels
Security device and head end in conditional access system and method for controlling illegal use in the system
Wireless mobile station with visible RF power disable indicator
Gapfill using deposition-etch sequence
Polyester filamentary yarns
Specific cassette selection apparatus
Protection device of a surge protector
Semiconductor device fabricating method
Honing and deburring tool