Resources Contact Us Home
Semiconductor manufacturing device and semiconductor manufacturing method

Image Number 4 for United States Patent #7141995.

A semiconductor manufacturing device includes a prober whose needles are at once engaged for contacting pads of two chip forming regions within a wafer. In one chip forming region, trimming is performed, while in the other chip forming region, inspecting posterior to trimming is performed.

  Recently Added Patents
Solid state lighting circuit and controls
LED light source lamp having drive circuit arranged in outer periphery of LED light source
Error recovery storage along a memory string
High conductive water-based silver ink
Case for electronic device
Method and apparatus of motion vector prediction with extended motion vector predictor
Mitigating single point failure of devices in an analyte monitoring system and methods thereof
  Randomly Featured Patents
Control system for a plurality of stepper motors
Method of making material exhibiting superconductivity characteristics
Latch-type needle for stitch-forming textile machine
Air-core microwave ablation antennas
Phthalocyanine and tetrabenztriazaporphyrin reagents
Automated system for manufacturing an LED light strip having an integrally formed connector
Integrated Internet camera
Data entry terminal for electronic computers
Integrated gas-phase hydrogenation process using heat recovered from sump-phase hydrogenation for temperature regulation