Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method of dividing a semiconductor wafer










Image Number 4 for United States Patent #7129150.

A method of dividing a semiconductor wafer comprising: a bonding film adhering step of adhering a bonding film for die bonding to the back surface of the semiconductor wafer; a protective adhesive tape affixing step of affixing an extensible protective adhesive tape to the bonding film side of the semiconductor wafer having the bonding film on the back surface; a dividing step of dividing the semiconductor wafer affixed to the protective adhesive tape into individual semiconductor chips by applying a laser beam along the streets; a bonding film breaking step of breaking the bonding film for every semiconductor chip by extending the protective adhesive tape so as to give tensile force to the bonding film; and a semiconductor chip removing step of removing the semiconductor chips having the broken bonding film from the protective adhesive tape.








 
 
  Recently Added Patents
Field-programmable analog array with memristors
Method and apparatus for content-aware resizing of data chunks for replication
Position pointer, variable capacitor and inputting apparatus
Pressure roller and fixing device equipped with the same
Pharmaceutical combination of pazopanib and topotecan to treat neuroblastoma, osteosarcoma, and rhabdomyosarcoma in a human
Method for manufacturing a substrate for a display device
Providing a multi-tenant knowledge network
  Randomly Featured Patents
Method for pigging hydrocarbon product flowlines
Symbolic finite automata
Method for training a system to specifically react on a specific input
Internal combustion engine with liquid coolant pump
Mobile chemical sprayer
Method of compressing and expanding dot-matrix character
Method of manufacturing a through-hole electrode substrate
Manufacturing method for a magnetic head supporting suspension
Microprocessor and method for deferred store data forwarding for store background data in a system with no memory model restrictions
(S)-alpha-ethyl-2-oxo-1-pyrrolidineacetamide