Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method of dividing a semiconductor wafer










Image Number 3 for United States Patent #7129150.

A method of dividing a semiconductor wafer comprising: a bonding film adhering step of adhering a bonding film for die bonding to the back surface of the semiconductor wafer; a protective adhesive tape affixing step of affixing an extensible protective adhesive tape to the bonding film side of the semiconductor wafer having the bonding film on the back surface; a dividing step of dividing the semiconductor wafer affixed to the protective adhesive tape into individual semiconductor chips by applying a laser beam along the streets; a bonding film breaking step of breaking the bonding film for every semiconductor chip by extending the protective adhesive tape so as to give tensile force to the bonding film; and a semiconductor chip removing step of removing the semiconductor chips having the broken bonding film from the protective adhesive tape.








 
 
  Recently Added Patents
Buckle
Image display device and capsule endoscope system
Comb
Integrated circuit having a discrete capacitor mounted on a semiconductor die
Generating a funding and investment strategy associated with an underfunded pension plan
Stool
Address generation unit for accessing a multi-dimensional data structure in a desired pattern
  Randomly Featured Patents
Single bowl sink
Shunted electrical connector and shunt therefore
Methods for scanning, printing, and copying multimedia thumbnails
Method for producing a cigarette filter rod
Method for setting up a data connection between terminal devices
Semiconductor laser assembly
Detent structure for rocker shaft
Rodent deterrent irrigation tube
Roller bearing assemblies and roller bearing assembly methods
Process for co-production of electricity and hydrogen-rich gas steam reforming of a hydrocarbon fraction with input of calories by combustion with hydrogen in situ