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Method of dividing a semiconductor wafer










Image Number 3 for United States Patent #7129150.

A method of dividing a semiconductor wafer comprising: a bonding film adhering step of adhering a bonding film for die bonding to the back surface of the semiconductor wafer; a protective adhesive tape affixing step of affixing an extensible protective adhesive tape to the bonding film side of the semiconductor wafer having the bonding film on the back surface; a dividing step of dividing the semiconductor wafer affixed to the protective adhesive tape into individual semiconductor chips by applying a laser beam along the streets; a bonding film breaking step of breaking the bonding film for every semiconductor chip by extending the protective adhesive tape so as to give tensile force to the bonding film; and a semiconductor chip removing step of removing the semiconductor chips having the broken bonding film from the protective adhesive tape.








 
 
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