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Wiring substrate and process for manufacturing the same










Image Number 4 for United States Patent #7122894.

A wiring substrate incorporating nickel-plated copper terminal pads for solder bumps, wherein a nickel plating layer constituting the nickel plated copper terminal pads has a phosphorus content of 8.5 to 15.0% by mass and is covered with a gold plating layer.








 
 
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