Resources Contact Us Home
Wiring substrate and process for manufacturing the same

Image Number 4 for United States Patent #7122894.

A wiring substrate incorporating nickel-plated copper terminal pads for solder bumps, wherein a nickel plating layer constituting the nickel plated copper terminal pads has a phosphorus content of 8.5 to 15.0% by mass and is covered with a gold plating layer.

  Recently Added Patents
Floor standing rack
Reference circuit with curvature correction using additional complementary to temperature component
Systems and methods for providing a video playlist
Bit error mitigation
Method and system for determining a suppression factor of a suppression system and a lithographic apparatus
Push button
Tracking data eye operating margin for steady state adaptation
  Randomly Featured Patents
Solar heating system
Paper sheet stacking apparatus
Toner for developing electrostatic images and process for producing the toner
Apparatus and method for producing inverse bubbles
Television camera
Method and system for DNA sequence determination and mutation detection with reference to a standard
Reticle for telescopic gunsight and method for using
Eyebrow template
Multi-user digital laser imaging system
Tripod stand for projection screen