Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Reinforced bond pad for a semiconductor device










Image Number 4 for United States Patent #7115985.

Disclosed herein are novel support structures for pad reinforcement in conjunction with new bond pad designs for semiconductor devices. The new bond pad designs avoid the problems associated with probe testing by providing a probe region that is separate from a wire bond region. Separating the probe region 212 from the wire bond region 210 and forming the bond pad 211 over active circuitry has several advantages. By separating the probe region 212 from the wire bond region 210, the wire bond region 210 is not damaged by probe testing, allowing for more reliable wire bonds. Also, forming the bond pad 211 over active circuitry, including metal interconnect layers, allows the integrated circuit to be smaller.








 
 
  Recently Added Patents
Variety corn line LIC7382
Pet cremation urn
Systems and methods for dissipating an electric charge while insulating a structure
Managing breakpoints in a multi-threaded environment
Herbicide composition having improved effectiveness, method of preparation and use
Method of operating an electromechanical converter, a controller and a computer program product
Measurement system service for a vehicle instrument panel
  Randomly Featured Patents
Detachable balloon catheter for endoscopic treatment of vesicoureteral reflux
Process for producing organophilic silica
Method and apparatus for semiconductor device fabrication
Semiconductor device with improved isolation between trench capacitors
Communication system of client terminals and relay server and communication method
Management apparatus, exposure method, and method of manufacturing device
Magnetoresistive sensor with improved performance and processability
Method for producing a PLZT compound
Use of multiple beams from frequency augmented laser radiation
Control circuit for a memory array