Resources Contact Us Home
Reinforced bond pad for a semiconductor device

Image Number 4 for United States Patent #7115985.

Disclosed herein are novel support structures for pad reinforcement in conjunction with new bond pad designs for semiconductor devices. The new bond pad designs avoid the problems associated with probe testing by providing a probe region that is separate from a wire bond region. Separating the probe region 212 from the wire bond region 210 and forming the bond pad 211 over active circuitry has several advantages. By separating the probe region 212 from the wire bond region 210, the wire bond region 210 is not damaged by probe testing, allowing for more reliable wire bonds. Also, forming the bond pad 211 over active circuitry, including metal interconnect layers, allows the integrated circuit to be smaller.

  Recently Added Patents
Electric double layer capacitor with non-equal areas of the active material layers of the positive electrode and the negative electrode
Global investment grade for natural and synthetic gems used in financial investments and commercial trading and method of creating standardized baskets of gems to be used in financial and comm
Recording medium, playback device, integrated circuit
TCP extension and variants for handling heterogeneous applications
Techniques for reducing arcing-related damage in a clamping ring of a plasma processing system
Mobile station and radio base station
Magnetic disk control device, magnetic disk apparatus, magnetic disk control method and computer program
  Randomly Featured Patents
Systems and methods for transmitting electromagnetic energy over a wireless channel having sufficiently weak measured signal strength
Multipositional apparatus for hanging things
Hooded air/fuel swirler for a gas turbine engine
Computer chair assembly
Method for the continuous production of tubular bodies
X-ray and gamma ray electron beam imaging tube having a sensor-target layer composed of a lead mixture
Optical fibre joint
Dynamic project management system
Session mobility in a full-mesh conference using session initiation protocol
Promoted porous catalyst