Resources Contact Us Home
Reinforced bond pad for a semiconductor device

Image Number 4 for United States Patent #7115985.

Disclosed herein are novel support structures for pad reinforcement in conjunction with new bond pad designs for semiconductor devices. The new bond pad designs avoid the problems associated with probe testing by providing a probe region that is separate from a wire bond region. Separating the probe region 212 from the wire bond region 210 and forming the bond pad 211 over active circuitry has several advantages. By separating the probe region 212 from the wire bond region 210, the wire bond region 210 is not damaged by probe testing, allowing for more reliable wire bonds. Also, forming the bond pad 211 over active circuitry, including metal interconnect layers, allows the integrated circuit to be smaller.

  Recently Added Patents
Triple-action pest control formulation and method
Use of a high-oleic and high-tocol diet in combination with a non-tocol antioxidant for improving animal meat quality
System and method for investing public deposits
Fan guide
Flexible organic light emitting device and manufacturing method thereof
PEGylated, extended insulins
Heterogeneous language data typing without executable regeneration
  Randomly Featured Patents
Collapsible container for plants
Method for manufacturing a semiconductor device having doped and undoped polysilicon layers
Doped titanium oxide additives
Universal drill-down system for coordinated presentation of items in different databases
Cathode ray tube color selection electrode mount
Exhaust gas recirculation control apparatus
Industrial robot with a telescopic horizontal arm
Determining an option for decommissioning or consolidating software
Liquid dispensing nozzle assembly and method of using same
Methods and systems for the detection of malignant melanoma