Resources Contact Us Home
Reinforced bond pad for a semiconductor device

Image Number 4 for United States Patent #7115985.

Disclosed herein are novel support structures for pad reinforcement in conjunction with new bond pad designs for semiconductor devices. The new bond pad designs avoid the problems associated with probe testing by providing a probe region that is separate from a wire bond region. Separating the probe region 212 from the wire bond region 210 and forming the bond pad 211 over active circuitry has several advantages. By separating the probe region 212 from the wire bond region 210, the wire bond region 210 is not damaged by probe testing, allowing for more reliable wire bonds. Also, forming the bond pad 211 over active circuitry, including metal interconnect layers, allows the integrated circuit to be smaller.

  Recently Added Patents
Generation of interpolated samples for decision based decoding
Anomalous data detection method
System and method for routing streaming data requests
Apparatus and method for noise removal by spectral smoothing
Method of treating lung cancer
Implantable defibrillator systems and methods with mitigations for saturation avoidance and accommodation
Sense-amplifier monotizer
  Randomly Featured Patents
MP3 player
Fuel pressure regulator
Product and process for T cell regulation
Intermediate for synthesis of Thromboxane B.sub.2
Optical disc apparatus
Rivet or the like
Sound absorbing device for sound insulation wall
System for customizing benefits for financial customers
Benzylketone phospholipase A.sub.2 inhibitors