Resources Contact Us Home
Reinforced bond pad for a semiconductor device

Image Number 4 for United States Patent #7115985.

Disclosed herein are novel support structures for pad reinforcement in conjunction with new bond pad designs for semiconductor devices. The new bond pad designs avoid the problems associated with probe testing by providing a probe region that is separate from a wire bond region. Separating the probe region 212 from the wire bond region 210 and forming the bond pad 211 over active circuitry has several advantages. By separating the probe region 212 from the wire bond region 210, the wire bond region 210 is not damaged by probe testing, allowing for more reliable wire bonds. Also, forming the bond pad 211 over active circuitry, including metal interconnect layers, allows the integrated circuit to be smaller.

  Recently Added Patents
Permitting access of slave device from master device based on process ID's
Once daily formulations of tetracyclines
Simplifying lexicon creation in hybrid duplicate detection and inductive classifier systems
Semiconductor device manufacturing method and device for same
Method and system for modeling a common-language speech recognition, by a computer, under the influence of a plurality of dialects
Organic elelectroluminescent display
  Randomly Featured Patents
Control signal buffer for use in an inserter system
Hair treatment compositions with polymers made from unsaturated saccharides, unsaturated saccharic acids or their derivatives
Unified messaging notification
Actuator with a triggerable element of variable length made of a multifunctional element
Aryl amine terminated polysulfide polymers, related compounds and processes for their preparation
Single wine drink vessel having a foodstuff compartment
Controlling passthrough of communications between multiple buses
Meat slicer
Method for reducing noise in speech signal and method for detecting noise domain
Threaded and coupled connection for improved fatigue resistance