Resources Contact Us Home
Reinforced bond pad for a semiconductor device

Image Number 4 for United States Patent #7115985.

Disclosed herein are novel support structures for pad reinforcement in conjunction with new bond pad designs for semiconductor devices. The new bond pad designs avoid the problems associated with probe testing by providing a probe region that is separate from a wire bond region. Separating the probe region 212 from the wire bond region 210 and forming the bond pad 211 over active circuitry has several advantages. By separating the probe region 212 from the wire bond region 210, the wire bond region 210 is not damaged by probe testing, allowing for more reliable wire bonds. Also, forming the bond pad 211 over active circuitry, including metal interconnect layers, allows the integrated circuit to be smaller.

  Recently Added Patents
Microwavable bag
Integrated circuit with electromagnetic intrachip communication and methods for use therewith
Image scanning apparatus and image forming apparatus
Systems and methods for programming an RFID reader
MRAM with sidewall protection and method of fabrication
Deceleration dependent shift control
Apparatus and method for providing vehicle data for testing product
  Randomly Featured Patents
Apparatus for inverting articles
Method for making capacitor elements
Booting and boot code update system using boot strapper code to select between a loader and a duplicate backup loader
Substrate floating apparatus and method of manufacturing liquid crystal display apparatus using the same
Repairable multichip module
Wire shower caddy
Container with pivoting cover
Centrifugal pump
ATM cell delay circuit for ISDN system
Dolly carrier