Resources Contact Us Home
Reinforced bond pad for a semiconductor device

Image Number 4 for United States Patent #7115985.

Disclosed herein are novel support structures for pad reinforcement in conjunction with new bond pad designs for semiconductor devices. The new bond pad designs avoid the problems associated with probe testing by providing a probe region that is separate from a wire bond region. Separating the probe region 212 from the wire bond region 210 and forming the bond pad 211 over active circuitry has several advantages. By separating the probe region 212 from the wire bond region 210, the wire bond region 210 is not damaged by probe testing, allowing for more reliable wire bonds. Also, forming the bond pad 211 over active circuitry, including metal interconnect layers, allows the integrated circuit to be smaller.

  Recently Added Patents
Multiple secure elements in mobile electronic device with near field communication capability
Vehicle control apparatus
Eyeglass component
Semiconductor assembly and semiconductor package including a solder channel
Method for producing male sterile plants using plant beclin 1/ATG6 expression
Memory device having collaborative filtering to reduce noise
Potato cultivar F10
  Randomly Featured Patents
System and method for electrostatic discharge protection using lateral PNP or PMOS or both for substrate biasing
Machining parameter optimizing apparatus, method for optimizing machining parameter and program therefor
Method for manufacturing a crankshaft for a combustion engine with several cylinders
Matable coaxial connector assembly having impedance compensation
Colored building boards, manufacturing methods thereof
Photolithographic alignment marks based on circuit pattern feature
Optical information recording medium
Rhodium hydroformylation catalyst
Clamping device for a protective device mounted on a safety headgear
Device for separating excess powder oversprayed when powder coating workpieces