Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Wafer level packaging of materials with different coefficients of thermal expansion










Image Number 8 for United States Patent #7109635.

An electro-mechanical device package includes a cap material permanently bonded to a device wafer encapsulating an electromechanical device. An intermediate material is used to bond the device and capping material together at a low temperature, and a structure including the intermediate material emanating from either the device or cap material, or both, provides an interlocking at the bonding interface. One package includes a reusable carrier wafer with a similar coefficient of thermal expansion as a mating material and a low cost cap wafer of different material than the device wafer. A method for temporarily bonding the cap material to the carrier wafer includes attaching the cap material to the carrier wafer and is then singulated to mitigate thermal expansion mismatch with the device wafer.








 
 
  Recently Added Patents
Searchlight
Lookup front end packet input processor
Method for sending status information in mobile telecommunications system and receiver of mobile telecommunications
Pharmaceutical powder compositions
Transmission apparatus, receiving apparatus, method, and storage medium
Myoglobin blooming agents, films, packages and methods for packaging
System and method for stranded file opens during disk compression utility requests
  Randomly Featured Patents
Background-based image segmentation
Trioctahedral phyllosilicates 2:1 of a stevensite or kerolite type modified post-synthesis, method of preparation and use in catalysis
Overhead door locking operator
Fire and heat resistant structure
Display drive apparatus and display apparatus
Wall-mount bracket
Phenylcarboximidates as pesticides
Method for welding shaped bodies made of carburized heat-resistant steel
Benzopyran derivatives and antihypertensive use thereof
Rotatable blade apparatus with individually adjustable blades