Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Wafer level packaging of materials with different coefficients of thermal expansion










Image Number 2 for United States Patent #7109635.

An electro-mechanical device package includes a cap material permanently bonded to a device wafer encapsulating an electromechanical device. An intermediate material is used to bond the device and capping material together at a low temperature, and a structure including the intermediate material emanating from either the device or cap material, or both, provides an interlocking at the bonding interface. One package includes a reusable carrier wafer with a similar coefficient of thermal expansion as a mating material and a low cost cap wafer of different material than the device wafer. A method for temporarily bonding the cap material to the carrier wafer includes attaching the cap material to the carrier wafer and is then singulated to mitigate thermal expansion mismatch with the device wafer.








 
 
  Recently Added Patents
ActRIIB proteins and variants and uses therefore relating to utrophin induction for muscular dystrophy therapy
Integrated analyses of breast and colorectal cancers
Stabilized redispersible polymer powder compositions
Remote management of networked systems using secure modular platform
Movable assemblies for an image reader unit and a cover unit in an image formation apparatus
Substrate processing apparatus and display method of substrate processing apparatus
Crosslinked core/shell polymer particles
  Randomly Featured Patents
Protective footwear
Systems and methods for facilitating a first response mission at an incident scene
Electronic circuit
Cycle frame assembly
Flow control valve
Method and apparatus for producing a waveform corresponding to a style of rendition using a packet stream
Weight compensation device for a lifting door
Personalized internet access
Mug
Acoustic sculpture