Resources Contact Us Home
Manufacturing methods of semiconductor devices and a solid state image pickup device

Image Number 3 for United States Patent #7087983.

A manufacturing method of manufacturing a semiconductor device having a plurality of wiring layers. The method includes the steps of forming a wiring by a first wiring layer as a pattern by dividing a desired pattern into a plurality of patterns, connecting the divided patterns, and exposing them, wherein a position of the connection is formed in parallel with the wiring which is formed by the first wiring layer, and forming a wiring by a second wiring layer having an area which intersects the connecting position by a batch processing of exposure.

  Recently Added Patents
Satellite fleet deployment
Method for producing SOI substrate and SOI substrate
Gateway channel utilization
Antisense modulation of C-reactive protein expression
Method of forming micropattern, method of forming damascene metallization, and semiconductor device and semiconductor memory device fabricated using the same
Mobile communication terminal provided with handsfree function and controlling method thereof
  Randomly Featured Patents
Disk drive printed circuit board with component-dedicated alignment line indicators including inner and outer line segments
Lithium-manganese composite oxide granular secondary particle, method for production thereof and use thereof
Dual piezoelectric fluid jet transfer valve
Communication system between master system and multiple slave systems in time division mode where a next slave is serviced upon receipt of final acknowledgement
1,1,2,2-Tetramethyl-1,2-disilacyclobutane and method for preparing same
Volume-based network management scheme
Selective HARQ combining scheme for OFDM/OFDMA systems
Television set
Bioadhesive compositions and biomedical electrodes containing them