Resources Contact Us Home
Manufacturing methods of semiconductor devices and a solid state image pickup device

Image Number 3 for United States Patent #7087983.

A manufacturing method of manufacturing a semiconductor device having a plurality of wiring layers. The method includes the steps of forming a wiring by a first wiring layer as a pattern by dividing a desired pattern into a plurality of patterns, connecting the divided patterns, and exposing them, wherein a position of the connection is formed in parallel with the wiring which is formed by the first wiring layer, and forming a wiring by a second wiring layer having an area which intersects the connecting position by a batch processing of exposure.

  Recently Added Patents
Method for forming contact in an integrated circuit
Kit and method for the capture of tumor cells
Light-emitting diode package and method for manufacturing the same
Method for forming pattern
Permeable pressure sensitive adhesive
Antitumoral compounds
  Randomly Featured Patents
Run-time tunable sample time in programming or modeling environments
Humanized antibodies against vascular endothelial growth factor
Whisker reinforced ceramic cutting tool and composition thereof
Small oval baking pan
Ball holder
Multi-gate carbon nano-tube transistors
Using error checking bits to communicated an address or other bits
Novelty frameless eye wear for promoting sociability
Method for coding and transmitting transport format combination indicator