Resources Contact Us Home
Manufacturing methods of semiconductor devices and a solid state image pickup device

Image Number 3 for United States Patent #7087983.

A manufacturing method of manufacturing a semiconductor device having a plurality of wiring layers. The method includes the steps of forming a wiring by a first wiring layer as a pattern by dividing a desired pattern into a plurality of patterns, connecting the divided patterns, and exposing them, wherein a position of the connection is formed in parallel with the wiring which is formed by the first wiring layer, and forming a wiring by a second wiring layer having an area which intersects the connecting position by a batch processing of exposure.

  Recently Added Patents
Image processing system, image processing method and program for image processing
Heating pad
Power saving methods for wireless systems
Frame timing synchronization in a geostationary satellite system
Group control method for machine type communication and mobile communication system using the method
Power management method for reducing power of host when turning off main monitor and computer system applying the same
Quantitative oxygen imaging systems and methods using echo-based single point imaging
  Randomly Featured Patents
Driving-force control apparatus and method for vehicle
Nasal passage cleaning composition
Vehicle roof with a roof opening closable by a cover
Stylus retaining mechanism for portable electronic device
Optical roller wave gauge
Adjustable lamp
Heating system for heating the passenger compartment of an automobile
Methods and apparatus for determining component alignment
TIR light valve
Insulated holder for container