Resources Contact Us Home
Manufacturing methods of semiconductor devices and a solid state image pickup device

Image Number 3 for United States Patent #7087983.

A manufacturing method of manufacturing a semiconductor device having a plurality of wiring layers. The method includes the steps of forming a wiring by a first wiring layer as a pattern by dividing a desired pattern into a plurality of patterns, connecting the divided patterns, and exposing them, wherein a position of the connection is formed in parallel with the wiring which is formed by the first wiring layer, and forming a wiring by a second wiring layer having an area which intersects the connecting position by a batch processing of exposure.

  Recently Added Patents
Semiconductor device
Methods of preventing and treating viral infections by inhibiting the deISGylation activity of OTU domain-containing viral proteins
Liquid crystal display panel
Radio communication system, transmission apparatus, reception apparatus, and radio communication method in radio communication
Reconstruction of deforming surfaces by canceling ambient occlusion and refining 3-D shape
Embedded bonding pad for image sensors
Handover signaling in wireless networks
  Randomly Featured Patents
Heat treatment apparatus and temperature measuring method thereof
Method and system for virtual lane assignment
Mass spectrometer for biological samples
Multi-purpose exercise bench system
Image forming apparatus to save toner and method to control the same
Chemical aid for use of scrap plastics in rubber formulations
Stabilized isothiazolone-containing compositions
4-cyano-4-deformylsordarin derivatives
System and method for determining the desirability of video programming events using keyword matching
Intelligent layer jump method