Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Manufacturing methods of semiconductor devices and a solid state image pickup device










Image Number 3 for United States Patent #7087983.

A manufacturing method of manufacturing a semiconductor device having a plurality of wiring layers. The method includes the steps of forming a wiring by a first wiring layer as a pattern by dividing a desired pattern into a plurality of patterns, connecting the divided patterns, and exposing them, wherein a position of the connection is formed in parallel with the wiring which is formed by the first wiring layer, and forming a wiring by a second wiring layer having an area which intersects the connecting position by a batch processing of exposure.








 
 
  Recently Added Patents
Plants and seeds of corn variety CV577261
Buffering stop structure and corresponding packing case
Storage system comprising multiple microprocessors and method for sharing processing in this storage system
Systems and methods for assigning a template to an existing network configuration
Wrench
Drive coil, measurement probe comprising the drive coil and methods utilizing the measurement probe
Rapid glycopeptide optimization via neoglycosylation
  Randomly Featured Patents
System and method of providing IMS services to users on terminating non IMS devices
Lithium salt of polyacetylene as radiation sensitive filaments and preparation and use thereof
Metered dispensing system with nested boat fitment
Microprocessor
Turbine blade attachment lightening holes
Preparation of hydroxycitronellol
Serine protease inhibitors
Scalable system for inverse discrete cosine transform and method thereof
Underground support devices
Current unit for arc welding