Resources Contact Us Home
Manufacturing methods of semiconductor devices and a solid state image pickup device

Image Number 3 for United States Patent #7087983.

A manufacturing method of manufacturing a semiconductor device having a plurality of wiring layers. The method includes the steps of forming a wiring by a first wiring layer as a pattern by dividing a desired pattern into a plurality of patterns, connecting the divided patterns, and exposing them, wherein a position of the connection is formed in parallel with the wiring which is formed by the first wiring layer, and forming a wiring by a second wiring layer having an area which intersects the connecting position by a batch processing of exposure.

  Recently Added Patents
One-dimensional metal nanostructures
Integrated analyses of breast and colorectal cancers
Developing device
Method of making and using an alpha-glucanase composition to reduce or remove biofilm
Method and apparatus for providing contention-based resource zones in a wireless network
System, method and program recording medium for supply capacity estimation
Active pulse blood constituent monitoring
  Randomly Featured Patents
Circular saw
Recording paper feeding device with paper position regulating member
Pesticide comprising soil desalinating agents
Charging-and-discharging device, battery pack and electronic apparatus including them
System and method for managing objects and resources with access rights embedded in nodes within a hierarchical tree structure
Substituted azetidinones
Methods for purifying adeno-associated virus particles
Wagering game with simulated mechanical reels
Plastics strips