Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Manufacturing methods of semiconductor devices and a solid state image pickup device










Image Number 3 for United States Patent #7087983.

A manufacturing method of manufacturing a semiconductor device having a plurality of wiring layers. The method includes the steps of forming a wiring by a first wiring layer as a pattern by dividing a desired pattern into a plurality of patterns, connecting the divided patterns, and exposing them, wherein a position of the connection is formed in parallel with the wiring which is formed by the first wiring layer, and forming a wiring by a second wiring layer having an area which intersects the connecting position by a batch processing of exposure.








 
 
  Recently Added Patents
Single check memory devices and methods
Organic EL display device and method for manufacturing the same
Single-pass Barankin Estimation of scatterer height from SAR data
Display screen or portion thereof with icon
Display device substrate, method for manufacturing the same, display device, method for forming multi-layer wiring, and multi-layer wiring substrate
Monitoring and correcting upstream packet loss
System and method for configuring software applications in a motor vehicle
  Randomly Featured Patents
Substrate-based chip package
Secure videoconferencing equipment switching system and method
Transmission type liquid crystal display device
Last-flash indicator switch in photoflash array
Roast-neutralization-leach technique for the treatment of laterite ore
Arrangement for defining improved cooling airflow supply path through clearance control ring and shroud
Gardening sprinkler
Method for growing strain-inducing materials in CMOS circuits in a gate first flow
Method for measuring the spectral distribution of electromagnetic radiation intensity and spectrometer of millimetric and far-infrared ranges for effecting same
Apparatus for quick disconnect of an arc welder torch