Resources Contact Us Home
Manufacturing methods of semiconductor devices and a solid state image pickup device

Image Number 11 for United States Patent #7087983.

A manufacturing method of manufacturing a semiconductor device having a plurality of wiring layers. The method includes the steps of forming a wiring by a first wiring layer as a pattern by dividing a desired pattern into a plurality of patterns, connecting the divided patterns, and exposing them, wherein a position of the connection is formed in parallel with the wiring which is formed by the first wiring layer, and forming a wiring by a second wiring layer having an area which intersects the connecting position by a batch processing of exposure.

  Recently Added Patents
Waterproof wound protector
Delay lines, amplifier systems, transconductance compensating systems and methods of compensating
Synthesis of amines and intermediates for the synthesis thereof
Method and system for constructing a customized web analytics application
Selecting a converter operating mode of a PA envelope power supply
System for setting programmable parameters for an implantable hypertension treatment device
  Randomly Featured Patents
Surface modification of metals for biomolecule detection using surface enhanced Raman scattering (SERS)
Omni-azimuthal pattern generator for VLF and LF communication
Multiple-satellite sensor algorithm wake up and reset strategy for an inflatable restraint system
Closing device for closing pressure fluid conveying channels in a housing
Interconnect structure having a via with a via gouging feature and dielectric liner sidewalls for BEOL integration
X-ray generator using hemimorphic crystal
Cyanidin compositions and therapeutic and diagnostic uses therefor
Low viscosity acrylate monomers formulations containing same and uses therefor
Method and device for knowledge based representation and display of three dimensional objects
Friction retard feeder with a composite feed element