Resources Contact Us Home
Manufacturing methods of semiconductor devices and a solid state image pickup device

Image Number 11 for United States Patent #7087983.

A manufacturing method of manufacturing a semiconductor device having a plurality of wiring layers. The method includes the steps of forming a wiring by a first wiring layer as a pattern by dividing a desired pattern into a plurality of patterns, connecting the divided patterns, and exposing them, wherein a position of the connection is formed in parallel with the wiring which is formed by the first wiring layer, and forming a wiring by a second wiring layer having an area which intersects the connecting position by a batch processing of exposure.

  Recently Added Patents
Image analysis platform for identifying artifacts in samples and laboratory consumables
Redriver circuits with power saving modes
Display substrate and method for manufacturing the same
Enhancing image quality
Process for producing slowly digestible starch
Asynchronous data integrity for enterprise computing
Corn inbreds like FAR601 and hybrids thereof
  Randomly Featured Patents
Sensor mounting structure with adjustable swivel ball and panel mounting mechanism
Symmetric and complementary differential amplifier
System and method for creating multi-priority streams
One piece wall bracket with corrugated wall penetrating projection
Composite metal-elastomer styled wheels and method and apparatus for molding the same
Remotely actuatable clasp and method
External fixation connection rod for rapid and gradual adjustment
Security door