Resources Contact Us Home
Manufacturing methods of semiconductor devices and a solid state image pickup device

Image Number 11 for United States Patent #7087983.

A manufacturing method of manufacturing a semiconductor device having a plurality of wiring layers. The method includes the steps of forming a wiring by a first wiring layer as a pattern by dividing a desired pattern into a plurality of patterns, connecting the divided patterns, and exposing them, wherein a position of the connection is formed in parallel with the wiring which is formed by the first wiring layer, and forming a wiring by a second wiring layer having an area which intersects the connecting position by a batch processing of exposure.

  Recently Added Patents
Crowd control barrier II
Implantable neuro-stimulation electrode with fluid reservoir
Motor with power-generation coil module
System and method for converting biomass to ethanol via syngas
Mobile communication method, mobile station, and network device
Method for conformal plasma immersed ion implantation assisted by atomic layer deposition
Method for producing a flexible composite elastomeric polyurethane skin
  Randomly Featured Patents
Method for making a dunnage shock absorber
Composition and method for treatment of otitis media
Apparatus for mixing thermoplastified synthetic resins
Replacement candle insert kit and method for using the same
Soccer goal securement monitor
Heat-resistant separator
Electronic level
Method for continuous drying of a material and an assembly for carrying out said method
Method and system in connection with tension measurement of material web
Animal control apparatus with ultrasonic link