Resources Contact Us Home
Manufacturing methods of semiconductor devices and a solid state image pickup device

Image Number 11 for United States Patent #7087983.

A manufacturing method of manufacturing a semiconductor device having a plurality of wiring layers. The method includes the steps of forming a wiring by a first wiring layer as a pattern by dividing a desired pattern into a plurality of patterns, connecting the divided patterns, and exposing them, wherein a position of the connection is formed in parallel with the wiring which is formed by the first wiring layer, and forming a wiring by a second wiring layer having an area which intersects the connecting position by a batch processing of exposure.

  Recently Added Patents
Protocol delay measuring device and protocol delay measuring method
Flexure with insulating layer isolating a portion of a metal substrate
Graphical communication user interface with graphical position user input mechanism for selecting a display image
Defensin polynucleotides and methods of use
Apparatus for transmitting and receiving data in a wireless communication system and method thereof
Nacelle cover
  Randomly Featured Patents
Process for producing a copper phthalocyanine compound
Positionable reflector
Arrangement for vertically positioning plate-shaped bodies
Vehicle sunroof installation
Inks for ink-jet printers
Method, system and article of manufacture for identifying regularly traveled routes
Two-member medicated device for rate-controlled administration of lipophilic pharmaceuticals
Image density control method for an image forming apparatus for reducing background contamination of a photoconductive drum
Method of using .alpha.-amylase to prepare slightly decomposed starch granules having low viscosity
Disk brake apparatus for motor vehicle