Resources Contact Us Home
Manufacturing methods of semiconductor devices and a solid state image pickup device

Image Number 11 for United States Patent #7087983.

A manufacturing method of manufacturing a semiconductor device having a plurality of wiring layers. The method includes the steps of forming a wiring by a first wiring layer as a pattern by dividing a desired pattern into a plurality of patterns, connecting the divided patterns, and exposing them, wherein a position of the connection is formed in parallel with the wiring which is formed by the first wiring layer, and forming a wiring by a second wiring layer having an area which intersects the connecting position by a batch processing of exposure.

  Recently Added Patents
High frequency vertical spring probe
Systems and methods for computer-aided fold detection
Fire detector
Methods of preventing and treating viral infections by inhibiting the deISGylation activity of OTU domain-containing viral proteins
Wireless subscriber managing storage of HARQ packets
Liquid crystal display device
Decoration holder
  Randomly Featured Patents
Distributor for use in a method of casting hot metal
Locking and unlocking system for the cockpit door of an aircraft and door with such a system
Device for supporting an art object in spaced relation to a wall surface
Weatherproofing of electrical connections with terminals on outdoor panels
Method for constructing a knowledge base, knowledge base system, machine translation method and system therefor
Vehicular mirror system with at least one of power-fold and power-extend functionality
Motor vehicle transmission
Method for indicating loaded firearm chamber
Tape dispenser
Perimeter sensing device