Resources Contact Us Home
Manufacturing methods of semiconductor devices and a solid state image pickup device

Image Number 11 for United States Patent #7087983.

A manufacturing method of manufacturing a semiconductor device having a plurality of wiring layers. The method includes the steps of forming a wiring by a first wiring layer as a pattern by dividing a desired pattern into a plurality of patterns, connecting the divided patterns, and exposing them, wherein a position of the connection is formed in parallel with the wiring which is formed by the first wiring layer, and forming a wiring by a second wiring layer having an area which intersects the connecting position by a batch processing of exposure.

  Recently Added Patents
Display fixture for highlighting products
Reuse of static image data from prior image frames to reduce rasterization requirements
Electronic device
Computer server capable of supporting CPU virtualization
Flexible circuit routing
Reliable and accurate usage detection of a software application
Method and apparatus for interactive distribution of digital content
  Randomly Featured Patents
Plastic container
Color wheel insert for selecting color schemes
Burn rate sensitization of solid propellants using a nano-titania additive
Control means including a diagnostic operating mode for a sterilizer
Set of capsules containing washing products
Storage device for the passenger compartment of a vehicle
Virtual user authentication system and method
Surface emitting device, manufacturing method thereof and projection display device using the same
Inkjet printhead having common conductive track on nozzle plate
Phase adjusting device, magnetic storage medium, and storage device