Resources Contact Us Home
Compressive alpha-tantalum thin film stack

Image Number 5 for United States Patent #7081306.

A layer of compressive alpha-tantalum is formed on a substrate by depositing a buffer layer on the substrate and depositing a layer of compressive alpha-tantalum on the buffer layer with lattice matching between the layer of compressive alpha-tantalum and the buffer layer. A bias may be applied to the substrate during deposition of the buffer layer and/or compressive alpha-tantalum layer. In some embodiments, the method may include depositing buffers layers comprising titanium, niobium, substantially pure aluminum or aluminum-copper alloy.

  Recently Added Patents
Closed-loop adaptive adjustment of pacing therapy based on cardiogenic impedance signals detected by an implantable medical device
Area reduction for surface mount package chips
Developing cartridge
Mixture, especially spinning solution
Inductive signal transfer system for computing devices
Internal wiring structure of semiconductor device
Load balancing for parallel tasks
  Randomly Featured Patents
Lid with an adjustable pouring and venting arrangement, particularly for primary color or paint containers utilized for car bodywork
Method and apparatus for providing proximity based authentication, security, and notification in a wireless system
Neutron transmutation doping of a silicon wafer
Cerebral protection with a gas comprising xenon
System and method for adjusting accumulated crash-discrimination measures based on crash progress
Toy ship
Changing codec information to provide voice over internet protocol (VoIP) terminal with coloring service
Process and apparatus for applying pressure to a reactant