Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Compressive alpha-tantalum thin film stack










Image Number 5 for United States Patent #7081306.

A layer of compressive alpha-tantalum is formed on a substrate by depositing a buffer layer on the substrate and depositing a layer of compressive alpha-tantalum on the buffer layer with lattice matching between the layer of compressive alpha-tantalum and the buffer layer. A bias may be applied to the substrate during deposition of the buffer layer and/or compressive alpha-tantalum layer. In some embodiments, the method may include depositing buffers layers comprising titanium, niobium, substantially pure aluminum or aluminum-copper alloy.








 
 
  Recently Added Patents
Adjustable box extender
Wind turbine
Vehicle drive control system
Electrode material and use thereof for production of electrochemical cells
Systems and methods for printing images outside a normal color gamut in image forming devices
User interface for integrating applications on a mobile communication device
Transactional consistency scheme
  Randomly Featured Patents
Porous anode bodies comprising niobium suboxide and capacitors containing such anode bodies
Methods of using (+)-2-[1-(3-ethoxy-4-methoxyphenyl)-2-methylsulfonylethyl]-4 acetylaminoisoindoline 1,3-dione
Device for cleaning viscous material
Locking apparatus with a key
System and method for compact storage and transmission of position and residual information usable in differential global positioning
Field effect transistor having a stressed dielectric layer based on an enhanced device topography
Performance evaluation of a G.dmt-compliant digital subscriber line system
Zirconium alloy products
Joining spacer
Interlocking grip for producing a soil stabilizing groundwork