Resources Contact Us Home
Compressive alpha-tantalum thin film stack

Image Number 5 for United States Patent #7081306.

A layer of compressive alpha-tantalum is formed on a substrate by depositing a buffer layer on the substrate and depositing a layer of compressive alpha-tantalum on the buffer layer with lattice matching between the layer of compressive alpha-tantalum and the buffer layer. A bias may be applied to the substrate during deposition of the buffer layer and/or compressive alpha-tantalum layer. In some embodiments, the method may include depositing buffers layers comprising titanium, niobium, substantially pure aluminum or aluminum-copper alloy.

  Recently Added Patents
Electron-beam lithography method with correction of line ends by insertion of contrast patterns
Process for preventing polymerization of cracked volatile products during pyrolysis and gasification
Buildable dinnerware
Method for culturing lactic acid bacterium and method for producing fermented milk
Method for producing SOI substrate and SOI substrate
Methods of preventing and treating viral infections by inhibiting the deISGylation activity of OTU domain-containing viral proteins
Method and system for detecting data modification within computing device
  Randomly Featured Patents
Pleated trouser crease-forming method and machine improvements therefor
Method for calibrating the measurements of an annular body
Substituted benzene derivatives or salts thereof
Hyperproduction of shoots during a vitro regeneration of plant
Method and apparatus for a token
Wheelchair suspension
Hollow medical wires and methods of constructing same
Methods, apparatus and articles of manufacture to process cardiac images to detect heart motion abnormalities
Method and apparatus for measuring on-wafer lumped capacitances in integrated circuits
Metal tubing roller or crowner