Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Compressive alpha-tantalum thin film stack










Image Number 5 for United States Patent #7081306.

A layer of compressive alpha-tantalum is formed on a substrate by depositing a buffer layer on the substrate and depositing a layer of compressive alpha-tantalum on the buffer layer with lattice matching between the layer of compressive alpha-tantalum and the buffer layer. A bias may be applied to the substrate during deposition of the buffer layer and/or compressive alpha-tantalum layer. In some embodiments, the method may include depositing buffers layers comprising titanium, niobium, substantially pure aluminum or aluminum-copper alloy.








 
 
  Recently Added Patents
Semiconductor fin device and method for forming the same using high tilt angle implant
Vehicle speed verification system and method
Circuit arrangement having a load transistor and a voltage limiting circuit and method for driving a load transistor
Multi-bank queuing architecture for higher bandwidth on-chip memory buffer
Accelerator for a read-channel design and simulation tool
Geographically self-labeling access points
Communication system
  Randomly Featured Patents
Fiber size, sized reinforcements, and articles reinforced with such reinforcements
In situ thermal processing of a hydrocarbon containing formation using pressure and/or temperature control
Wet electrostatic precipitator
Nitride semiconductor element and production method for nitride semiconductor element
Electron beam exposure apparatus and a method for electron beam exposure
Disk drive suspension assembly with a hinge arm attached at a recessed surface
Goggle
Three-group zoom lens
Rotary orienting feeder
Fuser belts with improved release and gloss