Resources Contact Us Home
Compressive alpha-tantalum thin film stack

Image Number 5 for United States Patent #7081306.

A layer of compressive alpha-tantalum is formed on a substrate by depositing a buffer layer on the substrate and depositing a layer of compressive alpha-tantalum on the buffer layer with lattice matching between the layer of compressive alpha-tantalum and the buffer layer. A bias may be applied to the substrate during deposition of the buffer layer and/or compressive alpha-tantalum layer. In some embodiments, the method may include depositing buffers layers comprising titanium, niobium, substantially pure aluminum or aluminum-copper alloy.

  Recently Added Patents
Display module
Process for preparing substituted aromatic carboxylic acids
Management of memory array with magnetic random access memory (MRAM)
Cellulose derivative and hydrogel thereof
Block copolymer nanoparticle compositions
System and method to obtain signal acquisition assistance data
Systems and methods for dissipating an electric charge while insulating a structure
  Randomly Featured Patents
Integrated devices for the determination of the alcohol content and/or the calorific value of fuels
Joint replacement method
Encoder wheel module and circuit board arrangement for an optical mouse with scrolling function
Method and system for linguistic command processing in a video server network
Method and apparatus for dispensing spherical-shaped quantities of liquid solder
Process for making pen/pet blends and transparent articles therefrom
Connecting socket for a semiconductor package
N-succinimidyl haloacetyl aminobenzoates as coupling agents
Membranes for use with capacitive electric vibration transducers in musical instruments
Planing apparatus with bridging cutters