Resources Contact Us Home
Compressive alpha-tantalum thin film stack

Image Number 3 for United States Patent #7081306.

A layer of compressive alpha-tantalum is formed on a substrate by depositing a buffer layer on the substrate and depositing a layer of compressive alpha-tantalum on the buffer layer with lattice matching between the layer of compressive alpha-tantalum and the buffer layer. A bias may be applied to the substrate during deposition of the buffer layer and/or compressive alpha-tantalum layer. In some embodiments, the method may include depositing buffers layers comprising titanium, niobium, substantially pure aluminum or aluminum-copper alloy.

  Recently Added Patents
Data latch circuit and electronic device
Antisense modulation of C-reactive protein expression
Navigation device, navigation method, and navigation program
LED illumination control using a simple digital command structure
Liquid crystal display
Communication system
2,5-disubstituted piperidine orexin receptor antagonists
  Randomly Featured Patents
Ink jetting device having metal electrodes with minimal electrical connections
Power take-off for compressors
Customizable backer for achieving consistent loading and engagement of array package connections
Stick for the billiard game
Method for manufacturing a belt
Bar code readers using surface emitting laser diode
Pinch cutting method and apparatus
Tire initiated vehicle control system
Dynamic file access control and management
System and method for proactive motor wellness diagnosis based on potential cavitation faults