Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Compressive alpha-tantalum thin film stack










Image Number 3 for United States Patent #7081306.

A layer of compressive alpha-tantalum is formed on a substrate by depositing a buffer layer on the substrate and depositing a layer of compressive alpha-tantalum on the buffer layer with lattice matching between the layer of compressive alpha-tantalum and the buffer layer. A bias may be applied to the substrate during deposition of the buffer layer and/or compressive alpha-tantalum layer. In some embodiments, the method may include depositing buffers layers comprising titanium, niobium, substantially pure aluminum or aluminum-copper alloy.








 
 
  Recently Added Patents
Semiconductor device and method of manufacturing the same
Dual work function recessed access device and methods of forming
Device and method for unified codes
Magnetic detection of small entities
Projection illumination system for EUV microlithography
Multilayered material sheet and process for its preparation
Snapshot isolation support for distributed query processing in a shared disk database cluster
  Randomly Featured Patents
Facility for fail-safe data transmission between trackside equipment of a guideway and vehicles moving therealong
Burner unit
Corrosion resistant core-plate and coatings therefor
Integrated delay circuit with PN-junction capacitor
Multiple-mode scanning and beam current control x-ray TV apparatus
System and method of forming a patterned conformal structure
Method of autonomous machine learning
Distribution system for a local area network
Air freshener
Substituted hydroxy pyridones