Resources Contact Us Home
Compressive alpha-tantalum thin film stack

Image Number 3 for United States Patent #7081306.

A layer of compressive alpha-tantalum is formed on a substrate by depositing a buffer layer on the substrate and depositing a layer of compressive alpha-tantalum on the buffer layer with lattice matching between the layer of compressive alpha-tantalum and the buffer layer. A bias may be applied to the substrate during deposition of the buffer layer and/or compressive alpha-tantalum layer. In some embodiments, the method may include depositing buffers layers comprising titanium, niobium, substantially pure aluminum or aluminum-copper alloy.

  Recently Added Patents
Advertisement in operating system
Food safety printer
Frame syncrhonization in orthogonal frequency-division multiplexing systems
Image display device and display unit for image display device
Dynamic reconstruction of a calibration state of an absorption spectrometer
Maize variety X00C175
Method for culturing lactic acid bacterium and method for producing fermented milk
  Randomly Featured Patents
Process for the chloromethylation of styrene-divinylbenzene copolymers
Mechanically decoupled opto-mechanical connector for flexible optical waveguides embedded and/or attached to a printed circuit board
Method of manufacturing a hockey puck
Lifting device adapted to be mounted in an openable structure
Cleaning and sanitizing system
Shoe upper
Barbecue grill shelf attachment
Method and structure for isolating integrated circuit components and/or semiconductor active devices
Nitride semiconductor light-emitting device comprising multiple semiconductor layers having substantially uniform N-type dopant concentration
Fluorescent lamp with improved efficiency