Resources Contact Us Home
Compressive alpha-tantalum thin film stack

Image Number 3 for United States Patent #7081306.

A layer of compressive alpha-tantalum is formed on a substrate by depositing a buffer layer on the substrate and depositing a layer of compressive alpha-tantalum on the buffer layer with lattice matching between the layer of compressive alpha-tantalum and the buffer layer. A bias may be applied to the substrate during deposition of the buffer layer and/or compressive alpha-tantalum layer. In some embodiments, the method may include depositing buffers layers comprising titanium, niobium, substantially pure aluminum or aluminum-copper alloy.

  Recently Added Patents
Use of cocoa extract
System and method for leveraging independent innovation in entertainment content and graphics hardware
Management of computer-file sharing between at least two devices
Communication apparatus and communication system
Lipoprotein analysis by differential charged-particle mobility
Writing implement
Methods of implanting dopant ions
  Randomly Featured Patents
Method for array processing of surface acoustic wave devices
Penstemon plant named `Peni Vio09`
Impact printer with variable delay for print cycle based on different print-hammer energy levels
System for varying dimensions of a substrate during nanoscale manufacturing
Radiator grill for a vehicle
Flexible container
Bathing implement
Blowing lance arrangement
Face monitoring system and method for vehicular occupants
Cycle for a dishwasher to reduce filming