Resources Contact Us Home
Manufacturing method of acoustic sensor

Image Number 4 for United States Patent #7080442.

The present invention relates to a semiconductor electret condenser microphone capable of being reduced in size and including an acoustic sensor 100 and a case 200 for accommodating the acoustic sensor 100, the acoustic sensor 100 has a semiconductor chip 110 forming necessary electronic circuits 111A to 111C, and opening a through hole 112 away from the electronic circuits 111A to 111C, an electrode layer 120 formed on the surface of the semiconductor chip 110 away from the through hole 112, an electret member 130 laminated away from part of the electrode layer 120 and through hole 112, and a diaphragm 140 provided with a spacing 160 to the electret member 130, in which the electrode layer 120 exposed from the electret member 130 is connected to the electrode 111a of the electronic circuit 111A through the case 200 (FIG. 6).

  Recently Added Patents
Flood protection apparatus and container data center including the same
Acoustic measuring instrument
Vehicle hood
System for encrypting and decrypting a plaintext message with authentication
Information recording medium and information processing method for accessing content with license or copyright protection
Method and system for shared high speed cache in SAS switches
Method of estimating remaining constant current/constant voltage charging time
  Randomly Featured Patents
Device for loading slices of bread in a toaster
Electrophotographic photoconductor for liquid development, image forming apparatus having the same, and image forming method
High resolution radiation imaging system
Radial pumping oil seal for fluid dynamic bearing motor
Device for promoting gravity flow of non-free-flowing solids
Domestic soda-water preparing device
Hydraulic machine
Detachable finger guard for a knife blade
Floating gate semiconductor device
Method and apparatus for the prevention of unwanted calls in a callback system