Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereof










Image Number 7 for United States Patent #7056406.

A porous adhesive sheet 1 having plural through holes 2 running in about parallel with each other in the thickness direction A of an adhesive organic film 3, wherein the through holes have about congruent sections in the diameter direction from one opening 2a to the other opening 2b and a production method thereof, and a semiconductor wafer with a porous adhesive sheet 31, which includes a semiconductor wafer 32 having an electrode 33, the porous adhesive sheet 1 adhered to the semiconductor wafer, and a conductive part 34 formed by filling a through hole 2 located on the electrode 33 with a conductive material, and a production method thereof are provided.








 
 
  Recently Added Patents
Portion of display panel or screen with an icon
Satellite mounting poles
Uplink interference mitigation method and apparatus
Automatic population of feature capabilities on a communication device
Push to release cover for a portable electronic device
System for wireless local area network (WLAN) transmission and for coexistence of WLAN and another type of wireless transmission and methods thereof
Production of battery grade materials via an oxalate method
  Randomly Featured Patents
Caddy for vacuum cleaner attachment tools
High efficiency light source projection apparatus
Novel norbornane- and norbornene-carboxylic acid amides thromboxan antagonists
Method for transmitting and receiving multicast and broadcast service
Liquid crystal display apparatus
Base for a telephone set
Data bus controller having a level setting circuit
Preparation of novel keto-esters
Circuitized structure including flexible circuit with elastomeric member bonded thereto
Space-efficient package for laterally conducting device