Resources Contact Us Home
Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereof

Image Number 6 for United States Patent #7056406.

A porous adhesive sheet 1 having plural through holes 2 running in about parallel with each other in the thickness direction A of an adhesive organic film 3, wherein the through holes have about congruent sections in the diameter direction from one opening 2a to the other opening 2b and a production method thereof, and a semiconductor wafer with a porous adhesive sheet 31, which includes a semiconductor wafer 32 having an electrode 33, the porous adhesive sheet 1 adhered to the semiconductor wafer, and a conductive part 34 formed by filling a through hole 2 located on the electrode 33 with a conductive material, and a production method thereof are provided.

  Recently Added Patents
Satellite mounting pole
Distortion compensation device, distortion compensation method, and radio transmitter
MRAM with sidewall protection and method of fabrication
Water purification using energy from a steam-hydrocarbon reforming process
Light transformation particle and photobioreactor
Uni-directional transient voltage suppressor (TVS)
Polarization-coupled ferroelectric unipolar junction memory and energy storage device
  Randomly Featured Patents
Method and apparatus for conducting an interactive design conference over the internet
Speaker for automotive audio system with vehicle panel utilized as sound amplifying medium
Thermal imaging process and an assemblage of a donor and receiving element for use therein
Lever operated transfer towel dispenser
Method and system for compact representation of routes
Portable computer arm unit
Process, apparatus, and material for making silicon germanium core fiber
Light fixture
Endarterectomy apparatus
Method and apparatus for handling building materials and implements