Resources Contact Us Home
Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereof

Image Number 4 for United States Patent #7056406.

A porous adhesive sheet 1 having plural through holes 2 running in about parallel with each other in the thickness direction A of an adhesive organic film 3, wherein the through holes have about congruent sections in the diameter direction from one opening 2a to the other opening 2b and a production method thereof, and a semiconductor wafer with a porous adhesive sheet 31, which includes a semiconductor wafer 32 having an electrode 33, the porous adhesive sheet 1 adhered to the semiconductor wafer, and a conductive part 34 formed by filling a through hole 2 located on the electrode 33 with a conductive material, and a production method thereof are provided.

  Recently Added Patents
Stepped delay control of integrated switches
Communication system and time synchronization method
Electronic package with fluid flow barriers
Interlock apparatus for vacuum circuit breaker
Apoptosis inductor extracted from potato, potato foodstuff containing the inductor, and processed product thereof
System and method for deposition in high aspect ratio magnetic writer heads
Bid optimization in search engine marketing
  Randomly Featured Patents
Comparator circuit
Method and apparatus for sub cache line access and storage allowing access to sub cache lines before completion of line fill
Micro-spring interconnect systems for low impedance high power applications
Fast cluster failure detection
Acid based micro-emulsions
Lightweight body respirator having flexible walls
Process for the preparation of cyclohexanones
Device and method for displaying a residual amount of cartridge ribbon for a color video printer
Device for coupling a pair of rods
Sending media data via an intermediate node