Resources Contact Us Home
Compact system module with built-in thermoelectric cooling

Image Number 13 for United States Patent #7022553.

An improved integrated circuit package for providing built-in heating or cooling to a semiconductor chip is provided. The improved integrated circuit package provides increased operational bandwidth between different circuit devices, e.g. logic and memory chips. The improved integrated circuit package does not require changes in current CMOS processing techniques. The structure includes the use of a silicon interposer. The silicon interposer can consist of recycled rejected wafers from the front-end semiconductor processing. Micro-machined vias are formed through the silicon interposer. The micro-machined vias include electrical contacts which couple various integrated circuit devices located on the opposing surfaces of the silicon interposer. The packaging includes a Peltier element.

  Recently Added Patents
Method and apparatus for wireless communication in a mesh network with central control of communication relationships
For a given cell in a spreadsheet, evaluating an unlimited number of conditional formatting rules and applying multiple corresponding formats to the cell
Method and system for generating and displaying an interactive dynamic selective view of multiply connected objects
System and method for multi-tiered meta-data caching and distribution in a clustered computer environment
Portable electric circular saw
Display device and method of manufacturing the same
  Randomly Featured Patents
Control apparatus
Alpha-1-acid glycoprotein transgenic mice
Organic light emitting device and method of fabricating the same
Eyeglasses assembly
Ink droplet forming apparatus and method for use in ink jet printer system
Method of forming pattern for semiconductor device
Synchronized transmission
X-ray device
Hydroxyterephthalic acid
System and method for displaying a digital terrain