Resources Contact Us Home
Compact system module with built-in thermoelectric cooling

Image Number 13 for United States Patent #7022553.

An improved integrated circuit package for providing built-in heating or cooling to a semiconductor chip is provided. The improved integrated circuit package provides increased operational bandwidth between different circuit devices, e.g. logic and memory chips. The improved integrated circuit package does not require changes in current CMOS processing techniques. The structure includes the use of a silicon interposer. The silicon interposer can consist of recycled rejected wafers from the front-end semiconductor processing. Micro-machined vias are formed through the silicon interposer. The micro-machined vias include electrical contacts which couple various integrated circuit devices located on the opposing surfaces of the silicon interposer. The packaging includes a Peltier element.

  Recently Added Patents
Sealing member for piezoelectric resonator device, and piezoelectric resonator device
Integrated wire carrier for electrode array
Test method for inspection device, particularly for label seating inspection device
Motor drive component verification system and method
Motor and disk drive apparatus
Lead frame array package with flip chip die attach
Self assembly of elements for displays
  Randomly Featured Patents
Process for producing substrate provided with metal pattern and substrate provided with metal laminate
Display rack for storing and displaying articles
Golf club putter head
Pressurized oxygen for evaluation of molding compound stability in semiconductor packaging
Colorimetric indicator for the indication of the exhaustion of gas filters
Yarn tension control device
Apparatus for solid state digital imager tracking radiography
Adaptive defrost control for heat pump system
Variable resistance memory with lattice array using enclosing transistors
Ink compositions, processes for making them and uses thereof