Resources Contact Us Home
Compact system module with built-in thermoelectric cooling

Image Number 13 for United States Patent #7022553.

An improved integrated circuit package for providing built-in heating or cooling to a semiconductor chip is provided. The improved integrated circuit package provides increased operational bandwidth between different circuit devices, e.g. logic and memory chips. The improved integrated circuit package does not require changes in current CMOS processing techniques. The structure includes the use of a silicon interposer. The silicon interposer can consist of recycled rejected wafers from the front-end semiconductor processing. Micro-machined vias are formed through the silicon interposer. The micro-machined vias include electrical contacts which couple various integrated circuit devices located on the opposing surfaces of the silicon interposer. The packaging includes a Peltier element.

  Recently Added Patents
Over the counter medicinal container with surface ornamentation
User control of replacement television advertisements inserted by a smart television
Circuitry for measuring and compensating phase and amplitude differences in NDT/NDI operation
Reusing data in user run book automation
Integrated control system for stability control of yaw, roll and lateral motion of a driving vehicle using an integrated sensing system to determine longitudinal velocity
Faucet handle
Split-ring resonator creating a photonic metamaterial
  Randomly Featured Patents
Coil construction for voice coil motor
Fluid pulsation dampener having spiral grooved bellows
Journal bearing having vibration damping elements
Process and apparatus for separating coarse sand particles and recovering bitumen from tar sands
Rigid foam with improved "K" factor by reacting a polyisocyanate and polyester polyol containing low free glycol
Vector 3-component 3-dimensional Kirchhoff prestack migration
Method and apparatus for varying the density of drilling fluids in deep water oil drilling applications
Laser diode
Mat for timing competitions
Method of preparing complex-AZO pigment and complex-AZO pigment thereof