Resources Contact Us Home
Compact system module with built-in thermoelectric cooling

Image Number 13 for United States Patent #7022553.

An improved integrated circuit package for providing built-in heating or cooling to a semiconductor chip is provided. The improved integrated circuit package provides increased operational bandwidth between different circuit devices, e.g. logic and memory chips. The improved integrated circuit package does not require changes in current CMOS processing techniques. The structure includes the use of a silicon interposer. The silicon interposer can consist of recycled rejected wafers from the front-end semiconductor processing. Micro-machined vias are formed through the silicon interposer. The micro-machined vias include electrical contacts which couple various integrated circuit devices located on the opposing surfaces of the silicon interposer. The packaging includes a Peltier element.

  Recently Added Patents
Optical scanner and image-forming device
Leadless integrated circuit packaging system and method of manufacture thereof
Reducing energy and increasing speed by an instruction substituting subsequent instructions with specific function instruction
Relative pose estimation of non-overlapping cameras using the motion of subjects in the camera fields of view
Geo-coding images
Dynamic load profiling in a power network
Knee guard
  Randomly Featured Patents
Impurity scavenger pillow
Gas laser
Manifold absolute pressure control system and method for a hybrid electric vehicle
Mobile device, system, and method for measuring characteristics of the mobile device
Packet switch and packet switching method
Combined hood and front grill portion of an agricultural tractor
Apparatus for controlling and protecting a vehicle seat suspension
Method and apparatus for controlling mold clamping force based on detected hydraulic pressures
Catheter clamp
Method for continuously casting wire or the like