Resources Contact Us Home
Compact system module with built-in thermoelectric cooling

Image Number 13 for United States Patent #7022553.

An improved integrated circuit package for providing built-in heating or cooling to a semiconductor chip is provided. The improved integrated circuit package provides increased operational bandwidth between different circuit devices, e.g. logic and memory chips. The improved integrated circuit package does not require changes in current CMOS processing techniques. The structure includes the use of a silicon interposer. The silicon interposer can consist of recycled rejected wafers from the front-end semiconductor processing. Micro-machined vias are formed through the silicon interposer. The micro-machined vias include electrical contacts which couple various integrated circuit devices located on the opposing surfaces of the silicon interposer. The packaging includes a Peltier element.

  Recently Added Patents
Direct file transfer between subscribers of a communications systems
Controller for machine tool and five-axis simultaneous control machine tool controlled thereby
Method and assembly for determining the temperature of a test sensor
Double diffused metal oxide semiconductor device and manufacturing method thereof
Kit and method for the capture of tumor cells
Method for transmitting an electronic short message to multiple receivers
Method for inhibiting thermal run-away
  Randomly Featured Patents
Transmission including planetary gear set arrangement
Actuating handle for motor-vehicle door latch
Device for forming a supply bobbin from a thread advanced from a yarn supply
Electronic printing apparatus
Jewelry pendant
Selectively-permeable membrane and the use thereof
Realization method of self-equalized multiple passband filter
Image generating method and apparatus, recording medium and random number generator
Dish rack
Method and system for contacting of a flexible sheet and a substrate