Resources Contact Us Home
Compact system module with built-in thermoelectric cooling

Image Number 13 for United States Patent #7022553.

An improved integrated circuit package for providing built-in heating or cooling to a semiconductor chip is provided. The improved integrated circuit package provides increased operational bandwidth between different circuit devices, e.g. logic and memory chips. The improved integrated circuit package does not require changes in current CMOS processing techniques. The structure includes the use of a silicon interposer. The silicon interposer can consist of recycled rejected wafers from the front-end semiconductor processing. Micro-machined vias are formed through the silicon interposer. The micro-machined vias include electrical contacts which couple various integrated circuit devices located on the opposing surfaces of the silicon interposer. The packaging includes a Peltier element.

  Recently Added Patents
Classifying documents using multiple classifiers
Method for manufacturing semiconductor element and semiconductor device, and deposition apparatus
Method and system for remapping processing elements in a pipeline of a graphics processing unit
Health monitoring of applications in a guest partition
Processing biomass
Sending targeted product offerings based on personal information
  Randomly Featured Patents
Boat ladders
Electively detachably coupled ball joint and pivot cup combination for a wind-propelled surfboard
Apparatus for attaching to bone
Frame for a case, wallet or similar device
Multi-function, self-service health kiosk
Optical transmission system and optical node
Barbecue grill assembly
Method and arrangement for regenerating a contaminated metal bath
Gallium nitride high electron mobility transistor structure
Shooting pot with combined valve and piston