Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method making bonding pad










Image Number 6 for United States Patent #6987057.

An bonding pad structure has a passivation layer over a copper layer having a pad window to expose a portion of the copper layer, a barrier layer conformal to a profile of the pad window, and an aluminum pad located in the pad window. The metal layer can be an aluminum, aluminum alloy or aluminum dominated layer for providing a better adhesion property between the copper layer and the bonding wire.








 
 
  Recently Added Patents
Location-based method to specify ratio frequency spectrum rights
Magnetic detection of small entities
Vehicle battery with cell balancing current paths and method of charging the same
Fusing device to prevent overheating of a heating member and image forming apparatus having the same
Piano keyboard with key touch point detection
Screen
Multi charged particle beam writing apparatus and multi charged particle beam writing method
  Randomly Featured Patents
Catalytic cracking of hydrocarbons
Lighting device incorporating plasma lamp for vehicles
Anti-shading method and apparatus for image sensor
Excretion of potassium ion by prostanoic acid derivatives
Stabilized lithium electrochemical cells containing an alkoxy silane
Sleeping bag
Spinning fishing reel
Antibiotic eluding intramedullary nail apparatus
Reactive diluent and curable resin composition
Boundary route setting device for a map display system