Resources Contact Us Home
Method making bonding pad

Image Number 6 for United States Patent #6987057.

An bonding pad structure has a passivation layer over a copper layer having a pad window to expose a portion of the copper layer, a barrier layer conformal to a profile of the pad window, and an aluminum pad located in the pad window. The metal layer can be an aluminum, aluminum alloy or aluminum dominated layer for providing a better adhesion property between the copper layer and the bonding wire.

  Recently Added Patents
Lithographic apparatus and device manufacturing method
Apparatus and method for categorizing services using canonical service descriptions
High-frequency power amplifier
Process and apparatus for producing composite material that includes carbon nanotubes
Systems and methods for providing a shared folder via television
Information display device and program storing medium
Imidazolidine-2,4-dione derivatives, and use thereof as a cancer drug
  Randomly Featured Patents
Multifunctional operating unit for nautical use
Method for making a packing laminate
Multiple data rate interface architecture
Portable shampoo basin
Web page creation supporting system, Web page creation supporting apparatus, Web page creation supporting method, computer program, and record medium
Optical module
Method for processing a digital image and image representation format
Insulation sleeve assembling apparatus
Engineered zinc finger proteins targeting plant genes involved in fatty acid biosynthesis
Bottled gas valve safety shield apparatus