Resources Contact Us Home
Method making bonding pad

Image Number 6 for United States Patent #6987057.

An bonding pad structure has a passivation layer over a copper layer having a pad window to expose a portion of the copper layer, a barrier layer conformal to a profile of the pad window, and an aluminum pad located in the pad window. The metal layer can be an aluminum, aluminum alloy or aluminum dominated layer for providing a better adhesion property between the copper layer and the bonding wire.

  Recently Added Patents
Vehicle lamp component
Efficient paging in a wireless communication system
Emergency power-off button with proximity alarm
Methods and systems for enabling community-tested security features for legacy applications
Profile and template based dynamic portable user workflow
Neurostimulation system
Intelligent and automated code deployment
  Randomly Featured Patents
Animated character system with real-time control
Tobacco composition with bluish dogbane and a process for the preparation thereof
Apparatus for aligning hitches of towing and towed vehicles
Method of forming first level of metallization in DRAM chips
Phased array antenna for efficient radiation of microwave and thermal energy
Power testing apparatus
Recording information reproducing apparatus
System and method for detecting a location of fault in a cable
Voltage setting circuit in a semiconductor integrated circuit
Analog time adjustment for coincidence detection electronics