Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method making bonding pad










Image Number 6 for United States Patent #6987057.

An bonding pad structure has a passivation layer over a copper layer having a pad window to expose a portion of the copper layer, a barrier layer conformal to a profile of the pad window, and an aluminum pad located in the pad window. The metal layer can be an aluminum, aluminum alloy or aluminum dominated layer for providing a better adhesion property between the copper layer and the bonding wire.








 
 
  Recently Added Patents
Modular utility rack
Container
Apparatus and method for discharging capacitor of input filter of power supply, and power supply including the apparatus
Light-reflective anisotropic conductive paste and light-emitting device
Protein purification
Code reading apparatus, sales registering apparatus, and sales registering method
Lacrosse head
  Randomly Featured Patents
System for monitoring and analyzing solid contaminents in fluids
Heat storage device
Vehicle power unit structure
Variable valve control system and method for internal combustion engine
Pedal locking device for a loader
Multi-functional ruler
Stethoscope sheathing system
Failure analysis memory for semiconductor memory testing devices and its storage method
Office chair
Bacterial composition and its use