Resources Contact Us Home
Method making bonding pad

Image Number 6 for United States Patent #6987057.

An bonding pad structure has a passivation layer over a copper layer having a pad window to expose a portion of the copper layer, a barrier layer conformal to a profile of the pad window, and an aluminum pad located in the pad window. The metal layer can be an aluminum, aluminum alloy or aluminum dominated layer for providing a better adhesion property between the copper layer and the bonding wire.

  Recently Added Patents
Method of transmitting data using spatial multiplexing
Accordion bioreactor
Method for remotely measuring fluctuations in the optical index of refraction of a medium
Container pack
Cooking tray
Solid-state image sensing device and control method of solid-state image sensing device
Session transfer method, application server, and communications system
  Randomly Featured Patents
Color correction circuit for a color television receiver
Nanoparticles comprising a nanoparticle template and a polymer shell having an amide side chain, and method of making thereof
Method for producing a semiconductor wafer
Membrane switch with migration suppression feature
Method and apparatus for integrating a FLL loop filter in polar transmitters
Variety of geranium plant named `Tikpink`
Method and system for fabricating an electrooptical device
Low latency memories and systems using the same
Bridge circuit arrangement on electrical frequency converters which can be fed with a D.C. current
Surface acoustic wave passive transponder having parallel acoustic wave paths