Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method making bonding pad










Image Number 6 for United States Patent #6987057.

An bonding pad structure has a passivation layer over a copper layer having a pad window to expose a portion of the copper layer, a barrier layer conformal to a profile of the pad window, and an aluminum pad located in the pad window. The metal layer can be an aluminum, aluminum alloy or aluminum dominated layer for providing a better adhesion property between the copper layer and the bonding wire.








 
 
  Recently Added Patents
Rotation angle detecting device
Sparse data compression
Real-time application of filters based on image attributes
Flat panel crystal display employing simultaneous charging of main and subsidiary pixel electrodes
Method and apparatus for cutting high quality internal features and contours
Communication apparatus, power supply control method, display apparatus, communication method, and computer program product
Method for generating optical codes for a print-context
  Randomly Featured Patents
Shotgun shell dismantler
Heat spreader
Thermal interface adhesive and rework
Semiconductor device
Dry electrostatic precipitator
Leveling device and method for making same
Method of estimating degradation with consideration of hot carrier effects
Male buckle portion
Anti-Decoupling device for a spin coupling
Multiple purpose fastening device, system and method