Resources Contact Us Home
Method making bonding pad

Image Number 5 for United States Patent #6987057.

An bonding pad structure has a passivation layer over a copper layer having a pad window to expose a portion of the copper layer, a barrier layer conformal to a profile of the pad window, and an aluminum pad located in the pad window. The metal layer can be an aluminum, aluminum alloy or aluminum dominated layer for providing a better adhesion property between the copper layer and the bonding wire.

  Recently Added Patents
Supplier capability methods, systems, and apparatuses for extended commerce
Fringe field switching mode liquid crystal display panel
Dielectric insulation medium
Method and apparatus for providing auto-completion of information
Switched capacitor hold-up scheme for constant boost output voltage
Integrating multimedia capabilities with circuit-switched calls
Incrementally increasing deployment of gateways
  Randomly Featured Patents
Lateral resonant tunneling device having gate electrode aligned with tunneling barriers
Printing compositions
Absorption column with internal mixing chamber for absorption of acetylene
Antiskid brake control method
Valve actuating apparatus for resting the operation of a valve in internal combustion engine
Resistive temperature detector assembly
Light-emitting element and display device using same
Clamping mechanism for shear testing apparatus
Dialysate of peritoneal dialysis and its preparation method
Electroluminescence module