Resources Contact Us Home
Method making bonding pad

Image Number 5 for United States Patent #6987057.

An bonding pad structure has a passivation layer over a copper layer having a pad window to expose a portion of the copper layer, a barrier layer conformal to a profile of the pad window, and an aluminum pad located in the pad window. The metal layer can be an aluminum, aluminum alloy or aluminum dominated layer for providing a better adhesion property between the copper layer and the bonding wire.

  Recently Added Patents
Portable stand
Tire for motorcycle
Hydrofluorocarbon refrigerant compositions for heat pump water heaters
Power storage device and method for manufacturing the same
Shoe outsole with a surface ornamentation contrast
Method for using a super-slippery thin layer characterized by the method for making same
Methods and compositions for inhibition of neutrophil exocytosis
  Randomly Featured Patents
Pipeline system branch history table storing branch instruction addresses and target addresses with inhibit bits
Genesis foundation wall system
Personalized location information for mobile devices
Drain unit of starter
Thermal treatment of phosphate rock
Pocket tool having slidably extensible pliers
Agricultural material separator
Vehicle transportable cordwood cutting machine
Clam shell die cutter
Silica filled RTV compositions having adhesion to glass and ceramic materials