Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method making bonding pad










Image Number 5 for United States Patent #6987057.

An bonding pad structure has a passivation layer over a copper layer having a pad window to expose a portion of the copper layer, a barrier layer conformal to a profile of the pad window, and an aluminum pad located in the pad window. The metal layer can be an aluminum, aluminum alloy or aluminum dominated layer for providing a better adhesion property between the copper layer and the bonding wire.








 
 
  Recently Added Patents
Lateral double diffused metal oxide semiconductor device and method of manufacturing the same
Measuring current and resistance using combined diodes/resistor structure to monitor integrated circuit manufacturing process variations
Powerline communication device with load characterization functionality
Large scale data storage system with fault tolerance
Opportunistic modem
Turbulence sensor and blade condition sensor system
Mask blank, transfer mask, and film denseness evaluation method
  Randomly Featured Patents
Paper sheet discharge apparatus
Beverage preparation system, holder and apparatus
Variable flow rate pump for fluid
Refresh control for dynamic memory in multiple processor system
System for and method of planarizing the contact region of a via by use of a continuous inline vacuum deposition
Process for growing defect-free silicon wherein the grown silicon is cooled in a separate chamber
Gas separation by composite solvent-swollen membranes
Mounting structure of integrated circuit device having high effect of buffering stress and high reliability of connection by solder, and method of mounting the same
Two-stage local and global fingerprint matching technique for automated fingerprint verification/identification
Optical scanning device and imaging apparatus implementing the same