Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method making bonding pad










Image Number 5 for United States Patent #6987057.

An bonding pad structure has a passivation layer over a copper layer having a pad window to expose a portion of the copper layer, a barrier layer conformal to a profile of the pad window, and an aluminum pad located in the pad window. The metal layer can be an aluminum, aluminum alloy or aluminum dominated layer for providing a better adhesion property between the copper layer and the bonding wire.








 
 
  Recently Added Patents
Means to securely fixate pacing leads and/or sensors in vessels
Memory device having collaborative filtering to reduce noise
Dynamic learning method and adaptive normal behavior profile (NBP) architecture for providing fast protection of enterprise applications
Probe for ultrasound diagnostic apparatus
Clock face
Systems, computer programs, and methods for controlling costs of a healthcare practice
Address generation unit for accessing a multi-dimensional data structure in a desired pattern
  Randomly Featured Patents
Render engine, and method of using the same, to verify data for access and/or publication via a computer system
Pavement marking material
Mounting for brushes of electric motors
Propellant storage construction, parts therefor and methods of making the parts
Methods and systems to dynamically configure computing apparatuses
Switch device and electronic instruments equipped with the switch device
Optical recording medium having short wobble period length
Method and device for preventing check fraud
Duct tap with a crimped end
Side air bag