Resources Contact Us Home
Method making bonding pad

Image Number 5 for United States Patent #6987057.

An bonding pad structure has a passivation layer over a copper layer having a pad window to expose a portion of the copper layer, a barrier layer conformal to a profile of the pad window, and an aluminum pad located in the pad window. The metal layer can be an aluminum, aluminum alloy or aluminum dominated layer for providing a better adhesion property between the copper layer and the bonding wire.

  Recently Added Patents
Single-electron detection method and apparatus for solid-state intensity image sensors with a charge splitting device
Milk frother
Domain isolation through virtual network machines
Inkjet ink
Image processing apparatus and image processing method
Bezel-less electronic display
Flash drive
  Randomly Featured Patents
Dissolvable tool and method
Sulky for walk-behind mowers
Dispenser assembly for refrigerator and control method thereof
Internal combustion engine turbo charger
Pressure pulse generator
Press and an automatic curve-forming device therefor
Apparatus for producing a corrugated sheet
Gastrointestinal electrical stimulation
Irradiation verification device for radiotherapy installations, and method for handling thereof
Flame-retardant polycarbonate composition