Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Method making bonding pad










Image Number 5 for United States Patent #6987057.

An bonding pad structure has a passivation layer over a copper layer having a pad window to expose a portion of the copper layer, a barrier layer conformal to a profile of the pad window, and an aluminum pad located in the pad window. The metal layer can be an aluminum, aluminum alloy or aluminum dominated layer for providing a better adhesion property between the copper layer and the bonding wire.








 
 
  Recently Added Patents
Data modulation for groups of memory cells
Magnetic levitation motor used in lens module
Dynamic rebasing of persisted time information
Carbon dioxide capture system and methods of capturing carbon dioxide
Methods and compositions for wound healing
Method of forming an isolation structure
Methods and apparatuses for anti-shading correction with extended color correlated temperature dependency
  Randomly Featured Patents
Apparatus for drying printed or coated webs
Wire terminal connector
Crop gathering attachment for crop harvesting machine
Method and apparatus for polishing a substrate
Corrosion resistant metal tube and process for making the same
Toy face with noise making tongue
Display device, controller driver and driving method for display panel
Paper feeder and image forming apparatus including the same
Memory cell formation using ion implant isolated conductive metal oxide
Belt member and method of constructing same