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Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy










Image Number 18 for United States Patent #6984254.

A lead-free solder powder that can include a plurality of lead-free solder particles each having a general spherical shape with a diameter of 20 60 .mu.m. Each of the lead-free solder particles can contain Sn, Ag and Bi, with respective concentrations set such that the lead-free solder alloy has a melting temperature lower than a predetermined heat-resistant temperature of a work to be soldered.








 
 
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