Resources Contact Us Home
Integrated circuit package

Image Number 3 for United States Patent #6979907.

An integrated circuit package is provided. A substrate is provided having solder openings therein and a conductive layer thereon. The conductive layer is processed to form a plurality of pads over the solder openings in the substrate. A mask is formed over the plurality of pads and openings formed in the mask over at least two pads of the plurality of pads. An integrated circuit die is bonded over the substrate using a conductive adhesive where the conductive adhesive is placed in the openings in conductive contact with at least two pads of the plurality of pads.

  Recently Added Patents
Cytokine receptors associated with myelogenous haematological proliferative disorders and uses thereof
Monitoring cloud-runtime operations
System and method for stranded file opens during disk compression utility requests
Resin composition, prepreg, resin sheet, metal-clad laminate, printed wiring board, multilayer printed wiring board and semiconductor device
Self-diagnostic method and system for implantable cardiac device
Method for providing interactive site map
Systems and methods for controlling phasing of advancing substrates in absorbent article converting lines
  Randomly Featured Patents
Sintering aid
Substrate holding apparatus, polishing apparatus, and polishing method
Purification of 3,5-xylenol
Fuel blends
Method and system for sterilizing medical instruments
Production of multiple zinc-containing coatings
Digital camera
Account-level fraud detector and associated methods