Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Integrated circuit package










Image Number 3 for United States Patent #6979907.

An integrated circuit package is provided. A substrate is provided having solder openings therein and a conductive layer thereon. The conductive layer is processed to form a plurality of pads over the solder openings in the substrate. A mask is formed over the plurality of pads and openings formed in the mask over at least two pads of the plurality of pads. An integrated circuit die is bonded over the substrate using a conductive adhesive where the conductive adhesive is placed in the openings in conductive contact with at least two pads of the plurality of pads.








 
 
  Recently Added Patents
Cylindrical LED fixture
Battery structures and related methods
Sponge
Profiling activity through video surveillance
Fabrication method of packaging substrate having through-holed interposer embedded therein
Call admission control method and system
Signal judgment method, signal judgment apparatus, program, and signal judgment system
  Randomly Featured Patents
Bearing with alternative load path for extreme loads
Resist pattern forming method and semiconductor device manufacturing method
Lead-less semiconductor device with improved electrode pattern structure
Patch cord caddy
Supinating seat and control display for aircraft cockpits
On-board fuel inerting system
Circuit connection assembly for vehicle wire harness
Dual in-line package pin insertion and removal apparatus
Process and device for sterilizing tub-shaped containers
Method of manufacturing a probe card