Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Integrated circuit package










Image Number 3 for United States Patent #6979907.

An integrated circuit package is provided. A substrate is provided having solder openings therein and a conductive layer thereon. The conductive layer is processed to form a plurality of pads over the solder openings in the substrate. A mask is formed over the plurality of pads and openings formed in the mask over at least two pads of the plurality of pads. An integrated circuit die is bonded over the substrate using a conductive adhesive where the conductive adhesive is placed in the openings in conductive contact with at least two pads of the plurality of pads.








 
 
  Recently Added Patents
Method for treating oncological diseases
Entropy encoding and decoding using direct level and run-length/level context-adaptive arithmetic coding/decoding modes
Light emitted diode
Semiconductor fin device and method for forming the same using high tilt angle implant
System and method for detecting deadlock in a multithread program
Regenerative power storage system mounted on DC electric railway car
Head shield
  Randomly Featured Patents
Paddle handle latch release device and spring latch system using same
Soap tape dispenser
Image forming apparatus having function for forming composite image
Consistency checking of source instruction to execute previously translated instructions between copy made upon occurrence of write operation to memory and current version
System and method for signal synchronization in a communication system
Miniature motor
Automatic monitoring of digital communication channel conditions usinhg eye patterns
Cool air supplying apparatus and refrigerator having the same
Loudspeaker system for virtual sound synthesis
Maintenance assembly for a pagewidth printer having a motorized drive