Resources Contact Us Home
Integrated circuit package

Image Number 3 for United States Patent #6979907.

An integrated circuit package is provided. A substrate is provided having solder openings therein and a conductive layer thereon. The conductive layer is processed to form a plurality of pads over the solder openings in the substrate. A mask is formed over the plurality of pads and openings formed in the mask over at least two pads of the plurality of pads. An integrated circuit die is bonded over the substrate using a conductive adhesive where the conductive adhesive is placed in the openings in conductive contact with at least two pads of the plurality of pads.

  Recently Added Patents
Contactless electrical connector for an induction sensor, and sensor including such a connector
Modular sport center
Use of beta-adrenoceptor antagonists for the manufacture of a medicament of the treatment of disorders of the outer retina
Sign language keyboard and sign language searching apparatus using the same
Method and apparatus for complementing an instrument panel by utilizing augmented reality
Print system
  Randomly Featured Patents
Particle emission analysis for semiconductor fabrication steps
Tray insert movable between collapsed and erected positions
Programmable digital multiple event generator
Modular sleeper units
Redox flow battery
Image processing method and image display
Compact fuel cell stack structure
Lift-out probe having an extension tip, methods of making and using, and analytical instruments employing same
Variable pitch spindle line drilling machine
High performance cooled laser mirror