Resources Contact Us Home
Browse by: INVENTOR PATENT HOLDER PATENT NUMBER DATE
 
 
Integrated circuit package










Image Number 3 for United States Patent #6979907.

An integrated circuit package is provided. A substrate is provided having solder openings therein and a conductive layer thereon. The conductive layer is processed to form a plurality of pads over the solder openings in the substrate. A mask is formed over the plurality of pads and openings formed in the mask over at least two pads of the plurality of pads. An integrated circuit die is bonded over the substrate using a conductive adhesive where the conductive adhesive is placed in the openings in conductive contact with at least two pads of the plurality of pads.








 
 
  Recently Added Patents
Pharmaceutical and diagnostic compositions for use in the treatment and diagnosis of neurodegenerative diseases or amyloid diseases
Liquid crystal display device
Ascertaining presentation format based on device primary control determination
Method of bonding metallic members, and metallic bonded body
System for and method of remotely auditing inventoried assets
Method and system for simulating wireless networks
Image enhancement based on multiple frames and motion estimation
  Randomly Featured Patents
Medication infusion device with dose recharge restriction
Impatiens plant named `Balfuspeafro`
Preventing unauthorized distribution of media content within a global network
Apparatus and method for cooling an object
Interactive slot car systems
Compression and de-compression of column-interlaced, row-interlaced graylevel digital images
Base for a telephone set
Inks for pulsed electrical printing and methods of producing same
Combating arthropods with N,N-dimethyl-O-(3-substituted-pyrazol-5-yl)-carbamic acid esters
Plant prop