Resources Contact Us Home
Integrated circuit package

Image Number 3 for United States Patent #6979907.

An integrated circuit package is provided. A substrate is provided having solder openings therein and a conductive layer thereon. The conductive layer is processed to form a plurality of pads over the solder openings in the substrate. A mask is formed over the plurality of pads and openings formed in the mask over at least two pads of the plurality of pads. An integrated circuit die is bonded over the substrate using a conductive adhesive where the conductive adhesive is placed in the openings in conductive contact with at least two pads of the plurality of pads.

  Recently Added Patents
Method for increasing expression of active tumor necrosis factor receptor family member-Ig fusion proteins
Flat panel display device and stereoscopic display device
High conductive water-based silver ink
Electronic circuit having shared leakage current reduction circuits
Compounds for the reduction of .beta.-amyloid production
Secondary battery pack including insulative mounting member into which PCM is inserted in lateral direction
Fixing apparatus
  Randomly Featured Patents
Integrated heat pump system
Barbeque timer
Non-cutoff frequency selective surface ground plane antenna assembly
Ejector system for an IC pack connector apparatus
Thermoplastic molding compositions having improved _flexibility and cold impact strength based upon polyamides from _omega-aminocarboxylic acids and/or lactams having at least 10 carbon atoms
Disc brake caliper
Shower dispenser cartridge
Hair dye compositions based on 2,5-diamino-6-nitropyridine derivatives
Mounting arrangement for acceleration detector element
Constant velocity joint and image forming apparatus