Resources Contact Us Home
Integrated circuit package

Image Number 3 for United States Patent #6979907.

An integrated circuit package is provided. A substrate is provided having solder openings therein and a conductive layer thereon. The conductive layer is processed to form a plurality of pads over the solder openings in the substrate. A mask is formed over the plurality of pads and openings formed in the mask over at least two pads of the plurality of pads. An integrated circuit die is bonded over the substrate using a conductive adhesive where the conductive adhesive is placed in the openings in conductive contact with at least two pads of the plurality of pads.

  Recently Added Patents
Soybean EF1A promoter and its use in constitutive expression of transgenic genes in plants
Visual universal decryption apparatus and methods
Display screen with graphical user interface
Optical scanner and image-forming device
Sensor interface engineering
Representations of compressed video
Area efficient through-hole connections
  Randomly Featured Patents
Method of lithiating a tertiary chloro alkyl compound and the product provided by said method
Method of driving electron-emitting device, electron source, and image-forming apparatus
Parallel-to-serial converter
Triangular-shaped slide
Method for applying a conductive paint coating and articles made thereby
Electricity driven device and method for increasing the rotational inertia of a rotary object or the blade of a lawn mower
Conduit bending system
Process for making electrical connections to high temperature superconductors using a metallic precursor and the product made thereby
Method of making a connection to a microelectronic element