Resources Contact Us Home
Flip-chip BGA semiconductor device for achieving a superior cleaning effect

Image Number 7 for United States Patent #6956290.

In the flip-chip BGA semiconductor device of the present invention, a stiffener is bonded by means of adhesive on the surface of a substrate on which a semiconductor chip is mounted in the area surrounding the semiconductor chip, and gaps are provided between the substrate and the stiffener that each extend outwardly from positions that confront opposite sides of the semiconductor chip and that communicate with the ends of the substrate. These gaps can be formed by depressions that are provided in the substrate or in the stiffener.

  Recently Added Patents
Organic light emitting device connection methods
Method for detecting directions of regularity in a two-dimensional image
Use of deuterium oxide for the treatment of virus-based diseases of the respiratory tract
Emergency call notification for network services
Architectural panel with natural fossil spade leaf embossed surface
Fluid pressure responsive electric switch
Semiconductor device
  Randomly Featured Patents
Locking tab for hook-in type shelving
Equipment support pad and method
Fuel injection system with injection quantity learning function
Gaseous flux laser device
Fastening device
Porous particle aggregate and method therefor
Structured-text cataloging method, structured-text searching method, and portable medium used in the methods
Roughened bond coat for a thermal barrier coating system and method for producing
Method and apparatus for guiding a user during setup of a signal measurement system
Display screen with image