Resources Contact Us Home
Flip-chip BGA semiconductor device for achieving a superior cleaning effect

Image Number 4 for United States Patent #6956290.

In the flip-chip BGA semiconductor device of the present invention, a stiffener is bonded by means of adhesive on the surface of a substrate on which a semiconductor chip is mounted in the area surrounding the semiconductor chip, and gaps are provided between the substrate and the stiffener that each extend outwardly from positions that confront opposite sides of the semiconductor chip and that communicate with the ends of the substrate. These gaps can be formed by depressions that are provided in the substrate or in the stiffener.

  Recently Added Patents
Field device for determining or monitoring a physical or chemical process variable
Sensor system
Lamination sheet
Method and device for reliable estimation of network traffic
Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric region
Low cost mesh network capability
Arbitration for memory device with commands
  Randomly Featured Patents
Burglarproof device for vehicle
Game kit utilizing board and pieces
Method of manufacturing microlens array and microlens array
Method of making a paper decoration
Hearing aid with anti-feedback
Asbestos sample removal tool
Ligands for the HisB10 Zn.sup.2 + sites of the R-state insulin hexamer
Low temperature hydrogenation of gamma titanium aluminide
Image processing system